Electronics Forum | Tue May 29 12:35:36 EDT 2001 | genny
Dave, Sorry to drag this out some more. When I saw this thread I realized that we often get PWB's fabricated with a gold plated edge connector tab. However we have not ever given any specs to the fabricator regarding the gold plating - all we say i
Electronics Forum | Tue May 08 03:14:12 EDT 2001 | sinclair
We started our first ENIG process recently and to our surprise, we have many failure on the one and only BGA on the board. The BGA is a 31 mils pitch plastic. Sending the PCBA to 1 cycle of heating/cooling @ 70/-5 degree C yield 40% of failure. With
Electronics Forum | Tue May 08 15:05:08 EDT 2001 | davef
It�s reasonable to want to understand this strange looking fabrication, before moving on to other issues. Before moving on to that, tell us more about your thinking the silicon being from the BGA package. What kind of plastic package is this? Desc
Electronics Forum | Tue May 29 16:52:07 EDT 2001 | hussman
By far the easiest way is to track solder paste measurement on your board - or solder defects after reflow (key word- easiest). Why spend 2 weeks examining a stencil when it clearly doesn't make defects, or IS making defects. I find using 2-D data
Electronics Forum | Thu May 24 09:11:12 EDT 2001 | Grant Petty
Hi, I would agree. We purchased a TP9 just the slow machine, but we were a small company at the time, and it worked fantastic. Almost no maintenance, and it's a dream to changeover. The serivce in Australia is also very good, but that does not appl
Electronics Forum | Tue Jun 05 10:31:40 EDT 2001 | raton
I am glad someone in education is getting a clue. I thank you for caring enough about education to ask some great quesstions. My brother-in-law got his Phd a few years ago and teaches at the college level, he agrees with many out there that if educ
Electronics Forum | Wed Jun 13 13:50:49 EDT 2001 | DaveG
I don't have any actual "hard" data to give on improvements but, I can share some experiences with you. What we noticed when we implemented the Rheo pump was: No more solder "skips" on our boards, Improved print quality on our BGA's & 16mil fine pitc
Electronics Forum | Mon Jun 18 01:09:03 EDT 2001 | Dean Stadem
Igmar, If these parts are epoxied in place, and subsequently wave soldered, I would bet you a cup of coffee that they are cracking due to the thermal shock of the wave. Typically there is a valley or dip in the temperature after the pre-heat in the w
Electronics Forum | Mon Jun 18 13:29:34 EDT 2001 | nifhail
What is the recommanded profile for board which consist of 0402 & 0201 comps. to reduce the effect of tomb-stone. Slow ramp rate ? how slow is considered as slow. Soak time 60 or 120 C,at which end should I stick to? what is the best time before reac
Electronics Forum | Thu Jun 28 10:46:44 EDT 2001 | genny
Thank you. I'm sorry if I came across frustrated or anything, but I wasn't sure if people were ignoring the one question I kept asking or if, as you said, they just didn't know. Here's the deal. We are a small company rapidly growing into a larger
