Electronics Forum | Wed Nov 07 17:13:51 EST 2001 | fmonette
Hany, The guidelines for proper handling and storage of moisture sensitive components, like PBGAs are clearly documented in the joint IPC/JEDEC standard J-STD-033 (free download at http://www.jedec.org). In short you need to keep track of exposur
Electronics Forum | Tue Nov 13 19:52:47 EST 2001 | davef
1800??? That's not a Mictor part number. Huh? What??? Haaaa!!!! You gotta do what???? 1800 ofem??? Haaaa!!!! Sorry. It�s simple. Just ... * Cut all the SMT gull wing leads on both sides of the connector just above the solder. * Put the co
Electronics Forum | Wed Nov 14 20:30:26 EST 2001 | davef
Tks. So was the answer that you got close? [ala "Car Talk"] Some guy from Cal-fornie sends me spill. I get cigars from � Yeh, I know I hog the responses, but I learn by doing this. If I can communicate in print, I can better communicate in word
Electronics Forum | Tue Nov 20 20:56:23 EST 2001 | davef
You�re correct. The release characteristics of epoxy differ from solder paste. Consider: * Using print/flood stroke, on-contact print cycle. * Printing slow enough to fill the hole with adhesive. * Overcoming the thixotropic [The viscosity of thixo
Electronics Forum | Thu Dec 06 23:34:25 EST 2001 | Beny
Pls. help. I�ve problem with non-wetting defect at capacitor termination. I have faced this problem at the 2 kinds of termination. One is chip capacitor 0603 that its outer termination surface composed with 100 Sn (Lead free) and another one is Sta
Electronics Forum | Tue Dec 11 04:43:35 EST 2001 | maubrey
I am the director of a performance/art group who work with electroacoustic clothing. Esssentially we perform with electronic clothes that make sounds by react with/to the environment. Please take a look mat our web site (complete wi
Electronics Forum | Wed Jan 16 15:22:29 EST 2002 | Terry Burnette
In his book titled "Manufacturing Techniques for Surface Mount Assemblies" author R.J. Klein Wassink describes the relationship between solder land dimensions, component lead coplanarity, board warpage, solder volumes, and solder paste flux wetting b
Electronics Forum | Thu Jan 17 18:29:01 EST 2002 | Bill Loving
Dear Jason, Thank you for posting your request on SMTNET. Please note that ScanCAD International provides an upgrade path for all installed customers, regardless of the age of their system. Currently, hundreds of systems are installed in 37 countr
Electronics Forum | Thu Jan 17 18:33:24 EST 2002 | Bill Loving
Dear Jason, Thank you for posting your request on SMTNET. Please note that ScanCAD International provides an upgrade path for all installed customers, regardless of the age of their system. Currently, hundreds of systems are installed in 37 countr
Electronics Forum | Fri Jan 18 04:45:32 EST 2002 | wbu
Ianchan, baking as being part of pre-heating is obviously sensless cause the PCB will not maintain any of that heat till soldering. Common reason for prebaking PCB�s is getting the moisture out to prevent outgassing, warpage and maybe other defects.
