Electronics Forum | Wed Dec 17 09:53:26 EST 2003 | davef
IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards, Table 9-3 � Plated Through Hole Diameter To Lead Diameter Relationships will give you the standard information you require. If we can�t get proper hole fill after try
Electronics Forum | Fri Jan 16 18:37:03 EST 2004 | adlsmt
Anyone have an inexpensive vendor for high temp board labels?
Electronics Forum | Thu Jan 29 16:10:09 EST 2004 | blnorman
Another equipment manufacturer is Smart Sonic. Most equipment manufacturers have their own chemistries, but they are also willing to use other cleaners. What we have done is to send boards that need to be cleaned to the equipment manufacturer. W
Electronics Forum | Mon Feb 16 01:42:31 EST 2004 | Frank
I have used the Red-E-Set units from Production Solutions. They are simple to use.
Electronics Forum | Tue Feb 17 10:55:49 EST 2004 | bobbyv40
Hi Dave, 1. As far as speed of removing componants, we use a board preheater to bring board temp to about 150 C. Then add a flux and then flood all 4 sides of the componant with the low temp solder. Using a suction tool the part comes right off. The
Electronics Forum | Tue Feb 24 06:56:46 EST 2004 | jdumont
We clean some of our boards because we are in the medical and military industries.
Electronics Forum | Sat Feb 21 09:00:30 EST 2004 | davef
Here's another idea to try: Rotate the boards 90*
Electronics Forum | Tue Feb 24 16:21:13 EST 2004 | esoderberg
I should of said stencil cleaning. Sorry
Electronics Forum | Thu Mar 18 16:39:14 EST 2004 | Jed Johnson
A few good points have been made here: The profile could be ramping too fast. The profile could be gettting too hot. The profile may need to have more "soak" time before reflow to allow the board temperatue to equalize and the board to "relax" and st
Electronics Forum | Mon Mar 08 20:22:05 EST 2004 | davef
Wayne: Please describe the location and angle and direction of the crack relative to the board.