Electronics Forum | Mon Sep 22 15:32:20 EDT 2008 | davef
We see this fairly often. It doesn't affect solderability. Our analysis makes us think this coloration is copper. The reason copper appears on the surface may be that heat cycles increase the thinness and porosity of the immersion silver [IAg] coatin
Electronics Forum | Thu Oct 30 22:29:58 EDT 2008 | davef
For most applications, a nice square [or rectangle] pad works just fine. Assemblers ship boat loads of boards with these every day. It's reasonable for tight decoupling capacitor requirement applications to use round or radiused pads for components
Electronics Forum | Mon Nov 17 09:47:25 EST 2008 | cisridn
I would not recommend doing BGA soldering with only a hot air gun. I have done it in the past, but the boards would eventually come back from the field because the solder joints did not form correctly and the BGA would have to be reworked again. I
Electronics Forum | Fri Nov 21 16:48:05 EST 2008 | kennyg
Anyone have an 'easy' solution for reducing PCBA handling damage. I'm fighting low level chipped, scuffed and broken-off SMT parts. The damage is spread out across different areas of the assemblies. The assemblies are double sided SMT with 0402's
Electronics Forum | Tue Nov 25 11:58:31 EST 2008 | rway
Hello all, We are using z1850/60 machines. The APC test is damaging a 1.8V device on the board. The APC stimulates -/+3Vdc in fast mode. I understand the dangers of over-voltage. But what I need to know is how the part is being damaged when the ent
Electronics Forum | Mon Feb 02 15:25:44 EST 2009 | fishingfool
muarty, Each has their place. Rules based systems (algorithm) are harder to program and I have seen post on here with people saying there is no real difference in defect detection. Image based systems are much easier and intutitive to program.
Electronics Forum | Tue Apr 21 12:48:13 EDT 2009 | bk
ok you verified that the motor was bad. So now i would go back and verify that your voltages are still good on the back of the computer box and on the booster board. If they all check out fine. I would take the mot x board from your working machine a
Electronics Forum | Sat Apr 04 08:35:27 EDT 2009 | davef
Cause: Solder between the pad and the BGA on the pads being lifted has not melted. So, when you lift the BGA, you also lift those pads with the unmelted solder with the BGA. These pads are probably sinking the heat to a large copper plane in a inner
Electronics Forum | Mon Apr 13 12:06:53 EDT 2009 | jefflkupkt
BoardHouse, Thanks for the reply. The board supplier did cover the cost of the bare boards. Five years ago I saw a different part pass ET only to fail at final assembly test as well. One engineer called it "acid trap" on the inner layers where the
Electronics Forum | Mon Apr 13 14:36:18 EDT 2009 | leemeyer
I have seen this problem before. There is a cable that runs from the Quadalign board to the backside of the backplane. It is not secured in any way so it may have come loose in shipping. Open the right side panel on the machine. The Quadalign board
