Electronics Forum | Wed Jan 12 10:05:20 EST 2005 | Dreamsniper
we are using polyimide boards 6 inches x 7 inches, 2.5mm thick, 12 to 14 layers, for aerospace industries. I am using a long bake of 12 hours at 70'C prior to manufacturing or exposure to elevated reflow and wave soldering temperature. If schedule i
Electronics Forum | Thu Jan 13 03:38:18 EST 2005 | Base
Hi Grant, You say your design are increasingly using more passives. Do you mean you're using more and more components per board or is it only the ratio passives/IC's that is shifting? And are you also increasing volume or is it just the component-co
Electronics Forum | Wed Jan 12 10:15:43 EST 2005 | davef
We conformal coat our boards and get pretty good coverage along the edges of BGA. If you need coverage along the edges and are not getting it, your supplier may be able to recommend a different material or application method. Most often, underfill
Electronics Forum | Tue Feb 08 06:28:04 EST 2005 | teilo
We manufacture retrofit kits completley out of titanium for all types of Wave Solder Machines, we also manufacture titanium fingers. Avoid solder overflow damage with titanium board stiffners. Also we manufacture board carriers. We have already supp
Electronics Forum | Thu Feb 03 04:55:21 EST 2005 | Dougs
OK, component wide portion runs with the conveyor, so really both sides should heat and cool at the same rate. The crack is at the termination between end cap and ceramic body and run vertically up the end cap, so when we remove the cap it comes of
Electronics Forum | Mon Feb 21 13:35:04 EST 2005 | pmdeuel
we have a HSP 4796, and have had placement issues with 0402's. If you can rule out global correction, rev'ed boards and a loose nest or a lack of support under the board. Look at placement before reflow. If alignment problems are present before oven
Electronics Forum | Wed Feb 23 14:17:21 EST 2005 | scombs
We also have 4796's and 4791's and have had the same issues with 0402 parts.. All the suggestions listed in the last post will help quite a bit. We found our biggest problem was the board supports due to the operators using the wrong type of pins ,
Electronics Forum | Mon Feb 21 04:04:21 EST 2005 | abhirami
1.67 always on the sample boards measured. This is very fast and pretty good measurement for a paste dispense control. Boards do not stand out-side for long times. Inspect the height for critical components only, in the initial stages. Once your Cpk
Electronics Forum | Thu Feb 24 16:14:46 EST 2005 | davef
Rob: Why aren't the board houses over there going to lead-free HASL [not that HASL is the most wonderful thing on the planet]? What's the price delta on an unit basis for a x-HASL, now imm Ag board? Anyhow back to the point, so, you're proposing t
Electronics Forum | Mon Feb 28 04:10:07 EST 2005 | Rob
Hi Dave, Was planning on skipping the paste step & screen printing the adhesive straight onto the pad, then placing the component into the glue & curing. (Board has LEDs only) Regarding the lead-free HASL issue - not entirely sure on the board man
