Electronics Forum | Thu Dec 19 13:23:11 EST 2002 | gramsey
Now, this is good solid advice. If following this advice does not help there is something wrong with 1. the paste (reology failure) 2. the stencil (rough walls) 3. the board (bad design or fab) (in order of likelyhood)
Electronics Forum | Mon Dec 16 15:20:29 EST 2002 | sueph
Randy, are you baking initially for surface mount? These boards I'm talking about are just thru hole, so there would not be any bake between baking for part marking and wave solder.
Electronics Forum | Mon Dec 16 17:38:56 EST 2002 | davef
Baking boards in a nonvalue added activity. Quit doing it!!! As a routine production activity, it is either: * Totally unnecessary ... OR * Band-aid to cover for problems in fabrication, purchasing, or storage methods. Search the fine SMTnet Archi
Electronics Forum | Mon Dec 23 17:20:05 EST 2002 | davef
Try: * Prebake * Flux density * Conveyor speed * Upper preheat * Cooling time * Chip wave * Solder temperature You could add immersion depth (1/3 to 2/3 of the board) to convince yourself that it has the least impact of any variable in wave solderin
Electronics Forum | Mon Dec 30 07:20:13 EST 2002 | jax
What are some of the Chip-Shooter machines that have this Golden Board comparison? I am aware of a dimensional image overlay but no measurement is performed by the machine to determine accuracy on these systems that I am aware of. -JAX
Electronics Forum | Fri Jan 03 12:12:22 EST 2003 | richard
Good day and thanks for your comments Mike, What did I understood from your notes� 1) ROSE test (�extracting solution�) is probably good enough (with good equipment) to penetrate the space under my micro BGA. 2) I should test 2 parallel batches of
Electronics Forum | Tue Jan 14 11:30:33 EST 2003 | jsherrow
You may find that the higher volatage rated parts are thicker. Same footpring but "taller". Usually not a problem unless the board is inserted into a mold. BTDT.
Electronics Forum | Mon Jan 13 11:26:58 EST 2003 | russ
Could you provide the specific alloy info (percentage od each) OR provide the melting point of this alloy? Please also provide the component specs (pitch, ball diam.) And the pad size and design used on the board. Russ
Electronics Forum | Wed Jan 15 19:27:43 EST 2003 | praveen
Grainy finish of the solder joint also caused by higher reflow temp.So far we have observed grainy structure in case of gold plated board.
Electronics Forum | Wed Jan 15 19:27:44 EST 2003 | praveen
Grainy finish of the solder joint also caused by higher reflow temp.So far we have observed grainy structure in case of gold plated board.
