Electronics Forum: board (Page 786 of 1638)

Soldering on a Ground Plane

Electronics Forum | Thu Feb 10 09:08:21 EST 2000 | C.K.

We've got this hard-to-Wave-solder board where all of the SMD's are on a ground plane - in fact the entire bottom-side is a ground plane. Our designers have incorporated thermal relief on some of the pads, but for reasons unknown to us, they don't h

Re: Solder Paste Height

Electronics Forum | Sat Jan 06 21:56:54 EST 2001 | Greenman

While solder paste height is one possible process indicator, the other guys are right on the money - volume is key. One way to study overall paste volume is to measure every single pad, using a 3D laser analysis (see you next week for board 2)... OR

Re: Clean before conformal coating?

Electronics Forum | Fri Jan 05 09:23:10 EST 2001 | Brian Toleno

While there may not be any specific requirement to cleaning prior to coating, cleaning an assembly prior to coating will only serve to increase the reliability and integrity of the coating. Some residues from low-solids fluxes can interact with conf

Re: HASL vs. ENIG

Electronics Forum | Fri Dec 15 13:57:46 EST 2000 | genny

It is only after the reflow heating process that the peaks may show up, as the solder build up in some vias(due to HASL'ing) might drip down during reflow. I don't think I've ever heard of it being desirable to have a bare copper surface that will ox

Desperately looking for help

Electronics Forum | Wed Dec 13 10:11:36 EST 2000 | George

Hello to everyone. I am not a technician of any sort, so I don't even know the name of the part I'm going to ask you about. Basically I learned this stuff by myself. I bought me a Playstation One and tried to install a chip on it. Here's a pic of the

Re: solder balls on high temp.solder

Electronics Forum | Tue Dec 12 17:54:04 EST 2000 | ralph

I've had this problem myself, though in using water soluables. But the process to eliminate it is still the same. There are three possible causes for this to occure. Too much humidity, to much solder, and too much heat. Are you leaving the paste

Re: Glue Witness Pattern Verifiable by FUJI???

Electronics Forum | Thu Dec 07 16:15:47 EST 2000 | JAX

It doesn't matter because on a dual dot both dots should be the same size. If one of the dots is to small and is not read by the vision system the dot is bad and the board will be skipped. You don't have to read the dual dot as a single item. With th

Re: Broken capacitors

Electronics Forum | Mon Dec 04 11:14:03 EST 2000 | JimH

All, For what it's worth the only time I have experienced this phenom was when board support pins were misplaced on our chip shooter and these components (previously placed) were resting on the pins and cracking when we populated the other side o

Re: Broken capacitors

Electronics Forum | Wed Dec 06 07:41:48 EST 2000 | John

To the post on the depaneling system. Almost any smt component can (and will according to Murphy's law) be damaged during hand breakout. Our company began using SMT a few years ago, and our primary customer absolutely will not allow us to hand brea

Re: Stencil for 10 mils IC

Electronics Forum | Wed Nov 15 11:00:35 EST 2000 | Finepitch Services

"depending on your pad design"... To me, Wolfgang gave you the biggest secret... I guess he meant the real pad width you get on your board is the start point. Get the average measurement in mils and then cut it from the sides at the percentages he h


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