Electronics Forum | Wed May 28 08:25:08 EDT 2003 | davef
That's what we do [no more than three reworks or mods]. Your "four reworks permissable" was probably based on the 55110 five thermal cycles, counting wave soldering as the first cycle. How do you plan to keep track of each of those rework actions?
Electronics Forum | Thu Jul 17 11:36:41 EDT 2003 | caldon
My AOI wish list would include features that: 1)Character recognition, 2) Correct Placement (including missing), 3) Solder joint inspection (solder present), 4) Shorts, 5)Polarity check, 6)Coplanarity, 7)gerber/or Cad compatible (no gold boards), 8)e
Electronics Forum | Fri May 07 12:39:01 EDT 2004 | rontdc
Bruce, Using a foam fluxer with no-clean flux is a very touchy situation. It is imperative that the specific gravity of any flux be maintained within the manufacturers recommendations. If it is not, you will get icicles and bridging. Maintaining the
Electronics Forum | Fri May 07 16:24:08 EDT 2004 | bruce @ knoll
I did have my solder analyzed and it is clean. The Hollis preheat coils are a bit hard to control but I have measured the board top side and I am getting a temp of 105c just before wave contact. I would like to move to a spray fluxer but I am going
Electronics Forum | Wed Jun 11 12:29:19 EDT 2003 | JB
There are many variables that could cause components to be misplaced. Using the overall tack time reduction is in reality putting a band-aid on a larger problem. Are your small components shifted as well? ( 0402,0805 tec) Components "twisted or off
Electronics Forum | Wed Jun 25 18:17:48 EDT 2003 | Brian W.
Water soluble pastes generally work best with a ramp-to-spike reflow profile. Check your paste manufacturer's recommended profile. There are many factors that impact your profile; board thickness, component density, buried thermal masses, board si
Electronics Forum | Thu Jun 19 10:36:54 EDT 2003 | Jacob
Hi all I am having a reflow problem. Recently we started using a through hole connector with solder flux bearing technology on a densly populated board. The connector reflows at the same time as the smt components through reflow. The problem I am ha
Electronics Forum | Mon Jul 07 11:45:45 EDT 2003 | lromero
Do you know what the maximum temperature rating is for the devices. But in my past experience you could be seeing the following. Excess thermal ramp rates typically you would like to see 2 to 3C/sec in the reflow oven, if it is greater than this i wo
Electronics Forum | Thu Jul 03 12:03:00 EDT 2003 | slthomas
So, there is a crack or gap between: * Solder and component termination. Bingo Correct? Describe: * Coarseness / smoothness of the metal on the termination underneither the crack. * Solder left on the termination. Unfortunately at 45X I can't rea
Electronics Forum | Fri Jul 04 09:10:53 EDT 2003 | davef
With poorly cured mask: * Wave soldering: Expect to see thin wavy band of dross imbedded in the mask in the wave solder side. * Reflow soldering: Expect to see a pinto board where the two tones of mask are [1] normal color and [2] a lighter color, al
