Electronics Forum | Wed Nov 03 14:46:29 EST 2004 | dramos1
Hi Russ, Thanks for the reply. In IPC-A-610 Rev. C on section 5.2.9 {Mounting - Connectors] page 5-21 on the manual [January 2000], the acceptable class [1,2,3]listed 3 items. In order for the connector to be accepted, are all 3 items must be met? I
Electronics Forum | Tue Jan 11 14:39:42 EST 2005 | Grant
Hi, We also had a lot of problems with tant's on the Agilis feeders, but MYDATA have a feeder that can be adjusted, and it helped a bit, however we changed the machine to a larger version, that went from a HYDRA camera to a line scan camera, and all
Electronics Forum | Fri Jan 14 15:37:24 EST 2005 | gregp
Grant, By flex machine I simply mean a machine that can place the entire range of SMT components. I don't consider the majority of Japanese machines to be truly flex machines because they are always presented as two machine solutions. The first mac
Electronics Forum | Wed Jan 12 07:22:10 EST 2005 | cyber_wolf
We seem to have an accountability issue when it comes to operators building defective product. Currently we are putting a piece of masking tape with the assembly #, work order, and operator initials on our black trays at the end of the reflow oven. I
Electronics Forum | Mon Jan 24 22:28:57 EST 2005 | davef
In addition to the potential problems you mentioned, add: * Barrel cracking of PTH and via. * Lifted pads. * Warped boards. And the reason you're not using a solder fountain to to solder this connector is? Or use an old trick we've done here on SMT
Electronics Forum | Mon Jan 31 11:34:58 EST 2005 | Chunks
Testing vias may be acceptable, but not preferred. If you do test by via, it�s a last resort type of thing. Vias are always a pain in the real world. Generally, they are soldered by wave, so they aren�t always doomed correctly, plus residue build-
Electronics Forum | Wed Jul 06 09:51:23 EDT 2005 | Jack
Doug, It always seems easier to fix one or two problems by eye at the time. The real problem comes when the customer wants the same board run again later. You're okay if you saved the corrected placement routine, but if you end up moving the job t
Electronics Forum | Thu Feb 03 07:39:24 EST 2005 | davef
The component orientation was just for the calculation. It has no affect on what you're seeing. As an alternate explanation, it's possible that difference in temperature is causing the board to flex in the z-direction [as you say, it may not be f
Electronics Forum | Wed Feb 02 22:10:30 EST 2005 | T2
Higher Tg values are only one thing to look out for. Two other things that are very important to watch are the Td or Decomposition Temperature (the temperature that the epoxy actualy starts to break down), and the CTE for the material. Some Tg 14
Electronics Forum | Mon Feb 28 11:31:08 EST 2005 | russ
This sounds a lot like a profile that is killing flux activity prior to wave immersion. What is your topside preheat temp just prior to hitting the wave? What type of preheat do you have, convection or radiant? Are you using a chip/turbulent wave
