Electronics Forum | Thu Jun 14 15:29:29 EDT 2012 | davef
That you can get good solder flow when hand soldering seems to indicate that the temperature of your solder pot is too low. Still, I'm uneasy that you see gold on the pads after passing the board across the solder pot. Gold is so thin with ENIG. So
Electronics Forum | Thu Jun 14 06:13:47 EDT 2012 | ccgooi
I am running a product with board size ~18"X16". I faced stencil aperture positional accuracy issue which slightly shifted at both end of stencil at positive and negative in X direction thus causing solder paste to pad mis-registration. Due to this s
Electronics Forum | Fri Jun 29 10:56:56 EDT 2012 | jorge_quijano
Hi guys, I need your advise on this, I have a very uncommon PCB design (at least for me, I've never seen anything like this...) it is 32" x 18" x 0.062" and has 9 QFNs that are driving me crazy, I'm not able to get a good alignment, I can get a mediu
Electronics Forum | Thu Jul 05 11:26:08 EDT 2012 | cobham1
I need help with how long do I need to bake out double sided PCB's that have been cleaned. The units will not be reworked but instead will be moved on to hand stuffing. I have looked in IPC CH-65B and J-STD-033C. I get information for parts if I am r
Electronics Forum | Thu Jul 12 11:56:20 EDT 2012 | hegemon
You might try to complete all your soldering within a 72 hour or less time frame. For all intents treat your board like a moisture sensitive component after you have baked and completed SMT reflow. Wash, blow dry, and go direct to stuffing and com
Electronics Forum | Tue Aug 21 19:24:15 EDT 2012 | rway
Checksum will work if all your doing is analog/passive testing. Checksum systems do not have digital test capability. I would recommend a Teradyne z18xx system. We use 8 of them in our plant and have been for years. Used, these systems range from
Electronics Forum | Tue Sep 18 10:52:14 EDT 2012 | sarason
Sounds like a plan. The usual way is to count how many you use on the job either by pre-calculation. Or how many clicks the machine counts and save the data before switch off, then drop it back into a spread sheet. This depends very much on the mach
Electronics Forum | Thu Aug 30 20:35:51 EDT 2012 | davef
A common bottomside heater configuration is IR-Convection-Convection. One of the big advantages of the IR zone is its ability to allow the flux carrier to spread and dry slowly before the board reaches the convections zones, which can blow wet flux c
Electronics Forum | Fri Nov 23 06:34:43 EST 2012 | bandjwet
With all of the various techniques available for LGA rework including but not limited to: Bumping the part using a polyimide stencil http://www.solder.net/products/stencilmate Bumping the part using a metal fixture or http://www.finetech.de/advance
Electronics Forum | Wed Feb 20 10:12:27 EST 2013 | dontfeedphils
Hey Bill, it really depends on the material you're looking at using UR, SR, AR, the easiest to deal with being AR, although if you can find a UR that doesn't clog up the machine too bad those are usually more viscous and easier to apply selectively u