Electronics Forum: board (Page 876 of 1638)

Re: non-wetting on gold land pad

Electronics Forum | Fri Oct 29 09:36:42 EDT 1999 | Dave F

Chris: Thanks. SMTnet has a "Library." Buried deep within it is a listing of terms. The following is from that listing: Shadowing. When a component blocks the heat or solder wave flow from certain areas of the printed circuit board, resulting in

Re: Gold finger touch-up paint

Electronics Forum | Tue Oct 26 14:11:25 EDT 1999 | Dave F

Gary: Two things: 1 Reworking golding fingers is an old topic, check the SMTnet archives to get started. 2 Gold fingers should not be discoloring, unless: * You are doing something bad to them ... OR * Your supplier has doinked the process, which

Re: Gold Immersion - Soft Joints

Electronics Forum | Fri Aug 30 05:07:14 EDT 2002 | jason

Hi William, Can u help me out here. I am new at handling Au imm. PCBs, and I hope you can answer me these questions. 1) If Au has soft joints issues, why use it at all ? Not to mention it is extremely expensive. 2) What are the precautions that I

Re: DOUBLE SIDED SMT ASSY

Electronics Forum | Mon Oct 25 16:04:02 EDT 1999 | Dave F

Jerry: You don't have to yell, we can see you fine Are your first side component going to fall off of the board or have their reliability affected during second side processing? If not, go for it!! Lots of people reflow through hole components.

de-palleting

Electronics Forum | Thu Oct 21 14:06:22 EDT 1999 | Arthur

Hi all I am currently looking for a machine (automated or manual) to cut boards out of a pallet. The pallets are scored on both sides at 30 degrees. If anyone know of a manufactor that makes a machine to cut pallets, it would be most helpful. I am i

Re: Step down stencils using CBGA and 20 mil QFP's

Electronics Forum | Mon Oct 25 15:23:26 EDT 1999 | Dave F

Ron: You're really talking about a step-up stencil in the area of the BGA. I don't think your problem is a lack of solder, but who know? I think you should do some sections on returned boards from your customer to help determine the source of the

PWB packaging for shipment and storage

Electronics Forum | Wed Oct 20 10:41:22 EDT 1999 | Eric Lerz

Our company (assembler and user) has experienced some board problems relating to warpage and solderability. The manner in which they are packaged by our fabricators and stored in our stock prior to assembly has been questioned (as one of many factor

SMEMA

Electronics Forum | Wed Oct 20 01:43:34 EDT 1999 | Jorge L. Torres

We have a Yamazen PK-32E Magazine board Loader. It appears that at one time or another was connected with a Sanyo Pick & Place machine, which is a 24VDC system for SMEMA. I want to connect it to the DEK265 printer, which currently has an inspection s

0402's Tombstoning

Electronics Forum | Thu Oct 14 11:28:38 EDT 1999 | Bryan

We recently started designing boards using 0402's. The geometry was built using IPC specs but our contract manufacturer is having a yield problem. Approx. 20% of the 0402's are tombstoning. He claims the pads should be closer together; .4 mm between

PCB warpage

Electronics Forum | Thu Oct 14 04:28:29 EDT 1999 | Grace Chua

Hi there, I have quite a number of problematic bd due to warpage problem. I would like to know the method on how to measure PCB warpage, thus to decide on the dispositon of these boards. Another question, can these warp bd be rework/fix. Is there


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