Electronics Forum: boarded (Page 1146 of 1638)

Uneven thermal load in PCB design.

Electronics Forum | Mon Dec 09 09:54:16 EST 2002 | davef

Large copper pours create an unbalanced lay-up that is bad design practice, creating problems in fabrication and assembly. The hatching a previous poster mentioned could be an alternative. Stepping back a bit and wondering, what's the problem? You

Connector leads plating

Electronics Forum | Tue Dec 10 05:03:58 EST 2002 | praveen

We are having solder fillet finish issue. The solder looks like rough solder on the connector leads .The plating of the leads is Nickel (99.9% purity) and the PCB plating is imersion gold. I have tried fine tuning my reflow profiles an have used N2 i

Connector leads plating

Electronics Forum | Tue Dec 10 10:26:56 EST 2002 | davef

Questions are: * What is the current plating on the connector that is over the "plating of the leads is Nickel (99.9% purity)"? * What are the temperatures and durations at those temperatures that you read on these connector leads? * What solder allo

Lead Filled Bean Bags for Thru-Hole Wave Solder Components

Electronics Forum | Fri Dec 13 19:01:14 EST 2002 | Tooling Guy

I have heard of people using tiny lead-shot filled bags to hold down thru-hole components on circuit boards while running through a wave solder machine on selective solder pallets. How successful has this been? What kind of material is being used f

Sn43Pb43Bi14 Solder

Electronics Forum | Thu Dec 19 10:52:12 EST 2002 | bremerg

Does anyone have experience using Sn43Pb43Bi14 solder on high reliability circuit boards that are subjected from -55� Celsius to +85� Celsius? What companies/industries are using this solder? Does anyone have detailed information on what the proper

Lattice Orca heatsink to PCB

Electronics Forum | Thu Dec 19 20:03:27 EST 2002 | edmentzer

Does any one have any experince with heatsinking a 240 lead QFP such as the Lattice Orca to the PCB? I have a customer who would like to know how this might be done. We are thinking of using some solder paste under the center of the part, or using

oven reflow board stiffeners

Electronics Forum | Wed Jan 01 11:03:31 EST 2003 | davef

We just use stare titanium stiffeners from the wave soldering area. Titanium is probably over-kill for your needs, but will work. Sources for titanium stiffeners are: * APT 603.622.1211 Tom Dimagio * New Era Technology 603.669.77971 Jessie Ward * B

0603 - stencil thickness

Electronics Forum | Fri Jan 03 11:42:38 EST 2003 | soupatech

Hi, I am loading a new board with mostly 0603 packages. The pads are .5 mm apart and I am having a big problem with parts shifting towards eachother instead of centering on the pads. I believe this is caused by too much solder. I am using a 7mil sten

silver pads, reflow charateristics??

Electronics Forum | Fri Jan 24 11:05:38 EST 2003 | johnw

I fyour just using Sn/Pb in your paste even using nitrogen will lave you with slightly grainy joints. The silver from your PCB will disolve into the Sn/Pb at 'uncontrolled' rate what I mean is depending on the temperature and time above liquidous the

Profile control parameters

Electronics Forum | Tue Jan 21 11:11:07 EST 2003 | slthomas

OK, so the issue is with the variability of the alloys on the soldering surfaces and the subsequent variability of reflow temps. Sounds reasonable (actually obvious, now that I think about it), especially on the component side. We only use HASL fin


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