Electronics Forum | Fri Jun 25 00:16:11 EDT 2010 | leadthree
I got a report from Yageo yesterday with microsections and and and..... result: Cracks I did a test run on boards after ICT, but before coating. They are all ok. Seems the cracking happens somewhere after the ICT. But at that stage all assembly is a
Electronics Forum | Thu Jun 24 04:06:33 EDT 2010 | yesobamaa
Free site for you to sell/buy items and more I would like to share with you guys a good free site: http://www.topbuysell.com which I came across. It is completely free to register a membership and publish your buying/selling items free of charge. C
Electronics Forum | Tue Jul 06 09:22:52 EDT 2010 | rgduval
Sean, We suggest having the PCB tested for ionic cleanliness. It is conceivable that though the visible flux residue has been cleaned, there is still invisible, yet ionically significant residue in the area of the board/part. We also suggest ensur
Electronics Forum | Fri Jul 09 20:54:58 EDT 2010 | bandjwet
There is no such thing as "IPCA610 compliance". The correct way of looking at this that the boards were inspected to IPC Class I, II or III Revision XX (current Rev is "E") and met all of the criteria. From a commercial standpoint it would greatly
Electronics Forum | Tue Jul 20 15:10:00 EDT 2010 | vetteboy86
Recently we have expereinced solder issues with our reflow process. The issue is random and doesn't effect every assembly. I'm seeing extreme solder wicking, no solder flow onto the pads, only onto the leads of the components. I have tried to hand
Electronics Forum | Mon Aug 09 12:46:59 EDT 2010 | ppcbs
Try tinning pads with a high pH water soluble flux like Kester 2331-ZX or Alpha Metals 3355-HB is what we use. It will remove the contamination quick;y without having to scrape with a blade. If you have a large number of bare boards you can run them
Electronics Forum | Tue Jul 27 08:03:55 EDT 2010 | scottp
You have to figure this out for yourself for your paste. When I evaluate solder pastes I require good tack, no solder balls, and proper wetting after 4 hours at "reasonable" ambient conditions. I also print boards and put them in a temp/humidity ch
Electronics Forum | Tue Aug 10 09:42:33 EDT 2010 | kevslatvin
We are using the Red-E-Set supports from Production solutions in our Opal P&P machines and MPM SPM printer. Ours are the manual system though, they do have an automatic system. With theirs once you set them at the setup of the job you don't have to t
Electronics Forum | Tue Aug 17 10:26:26 EDT 2010 | quest@fr
Our customer ask us how many repair (component removal, change and soldering) we guaranty for SMT components on our printed wiring board. We all have the number "3" in mind but we can't justify it by a standard. We can't reply "state of the art". Doe
Electronics Forum | Wed Aug 18 09:41:47 EDT 2010 | namruht
Are you controlling humidity in your plant? I'm > not familiar with that particular paste, but some > pastes are sensitive to a humid environment. We > also had one paste supplier send us a batch that > had excessive solder balls if the boards