Electronics Forum | Wed Aug 11 23:55:19 EDT 1999 | Dean
| | I appreciate you're input on this, John, Scott. It's a neat thing Mydata did with the power out, status saved feature. That comes in handy a lot down here. | The problem is with our machine, however, "I think", is that we have one of our phases
Electronics Forum | Fri Jul 30 19:58:28 EDT 1999 | ScottM
| | | Hello Netters, | | | | | | I have a customer who wants us to aquaeos wash a PCB after all operations have been performed. The PWB is two layer FR4 with a Transformer, a Multichip Module with Conformal Coating, (6) 11" insulated wires that are
Electronics Forum | Thu Jul 29 12:33:38 EDT 1999 | Wolfgang Busko
| Currently, we are baking any PCB before process on SMT, the 'reason' is to dry any possible humidity that could be inner the PCB, it does not matter if the PCB is multilayer or not. We bake PCB's at 107C for 4 hrs and the board must be process into
Electronics Forum | Mon Jul 26 18:01:30 EDT 1999 | Earl Moon
| Presently protos of micro-bgas (80i/o) pitch .030/.031 | 12BGA per assembly | | The board is a (.062, 4 layers) FR-4 using Dry film | Pads .014inch | Vias within footprint .020inch | Vias to be filled by bottom side(solder side) only .030in dia. F
Electronics Forum | Thu Jul 29 15:44:29 EDT 1999 | Earl Moon
| Thanks Earl for your insight! I sometimes feel conspicuous as one of the few women I've seen frequenting this board, but everyone's been helpful and has resisted the overwhelming temptation to pat me on the head. | | From what you and some of the
Electronics Forum | Fri Jul 23 12:38:33 EDT 1999 | Earl Moon
| There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not performing
Electronics Forum | Mon Jul 26 10:44:08 EDT 1999 | Boca
| There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not performing
Electronics Forum | Thu Jul 22 12:05:33 EDT 1999 | John Thorup
| | Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead etc.) | | |
Electronics Forum | Wed Jul 21 01:24:06 EDT 1999 | Scott McKee
| I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk paste
Electronics Forum | Wed Jul 21 01:52:40 EDT 1999 | Scott McKee
| Dear all | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | Our appliocation is Mainly fabrication of mother boards. | Thanks | In theory, ICT is the classical answer (In-Circuit Test). In practic
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