Electronics Forum: boarded (Page 1361 of 1638)

Re: bare board problem

Electronics Forum | Fri Jun 18 23:13:08 EDT 1999 | Earl Moon

| | | Carson Valley Inn be hanged, | | | | | | Moonman | | | | | Carson Valley Inn, Wow they should have a plague there that says, "Mike Cox once Stayed here", Good Ol days | | | | Mike, until 4 years ago when I built my current home and moved,

Re: Cracked Capacitors

Electronics Forum | Mon Jun 14 08:48:29 EDT 1999 | Adam Pratt

| | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from man

Re: Cracked Capacitors

Electronics Forum | Mon Jun 14 11:39:29 EDT 1999 | Marshall

| | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from m

Re: fiducials

Electronics Forum | Wed Jun 09 13:11:29 EDT 1999 | John Thorup

| In past PCB designs I have cleared all traces from all layers | (except pwr/gnd) from fiducial area. It has come to my attention that this is only necessary on the side where fud is placed. Which is the correct method of design using a fidicial?

Re: fiducials

Electronics Forum | Wed Jun 09 15:03:53 EDT 1999 | Earl Moon

| In past PCB designs I have cleared all traces from all layers | (except pwr/gnd) from fiducial area. It has come to my attention that this is only necessary on the side where fud is placed. Which is the correct method of design using a fidicial?

Re: measuring pitch

Electronics Forum | Mon Jun 07 22:30:28 EDT 1999 | Dave F

| | | I was wondering what measurements are used to define pitch? | | | | | Frank: John's correct with the most common definition, but there can be others, depending on your perspective. TTYL Dave F | | | | Pitch. The center-to-center spacing b

Ralph Nader -- why/why not?

Electronics Forum | Thu Jun 03 12:22:14 EDT 1999 | Scott

Is there room for equipment related comments? Although vendor "bashing" may/may not be proper on the forum, I'd just LOVE to share experiences with equipment - why I won't buy a UPS from one oven vendor, or it wasn't said profiling was an optioin du

Process Change

Electronics Forum | Thu Jun 03 09:40:20 EDT 1999 | Ryan Jennens

In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We cannot

Re: Shear Testing

Electronics Forum | Mon Jun 07 11:21:38 EDT 1999 | Brian Wycoff

| | I need to perform shear tests on components that have been glued prior to wave soldering. Can any one recommend a shear tester and some standardized info on testing? We have had problems with poor glue bonds and would like to implement a test m

Re: Two AP-20 questions

Electronics Forum | Tue Jun 01 16:42:48 EDT 1999 | Scott S. Snider

| After lots of years with Panasert machines, I am starting to need to learn again. | 1. For the AP-20 can you retrofit 3D vision? Would you bother? | 2. Also for the AP, can you use 20x20 DEK screens with an adapter? | | Thanks to all you MPM expe


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