Electronics Forum | Thu Aug 06 10:30:41 EDT 1998 | Mike
| | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and t
Electronics Forum | Mon Aug 24 07:16:52 EDT 1998 | Paul Horan
| | | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and
Electronics Forum | Mon Aug 24 07:12:20 EDT 1998 | Paul Horan
| | | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and
Electronics Forum | Fri Aug 07 02:32:09 EDT 1998 | P.L. Sorenson - Technical Consultant
| | | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and
Electronics Forum | Sun Aug 02 20:31:22 EDT 1998 | karlin
Hi Bob, The weight of the TBGA is heavier then PBGA due to the Stainless steel heat sink. I have tried run them through the oven without paste. Due to the high lead content( 90Pb/Sn10), the "solder: did not melt. Still see the misalignment issue but
Electronics Forum | Tue Jul 28 17:23:58 EDT 1998 | Robert Steltman
| | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | | First some details: | | PCB & Device: | | ============= | | 1) 16 layer (4 power, 4 gnd, 8 signal) | | 2) gold on nickel finish | | 3) ceramic
Electronics Forum | Mon Jul 27 17:09:20 EDT 1998 | Rin
| We are trying to reduce the number of units fail at system test due to flux on gold finger. We know so far that the flux is deposited onto the | goldfinger during touch-up or rework and to reduce the contamination we are | planning to imp
Electronics Forum | Sun Jul 26 22:35:55 EDT 1998 | D.Lange
Masdi, Try board shunts. They are hi-temp rubber strips with grooves cut. They can be popped on and off with ease and are much faster than taping and considerably cheaper. They also work great for masking goldfingers prior to wave soldering. Contac
Electronics Forum | Fri Jul 24 13:45:12 EDT 1998 | Bob Willis
Yes you need solder paste for BGA. Have a look at the Free BGA documents on my home page which you can download. They cover design, rework, and general assembly www.bobwillis.co.uk | My firm has just begun it's first PCB that will use BGA packaging.
Electronics Forum | Wed Jul 22 13:50:49 EDT 1998 | Justin Medernach
| My firm has just begun it's first PCB that will use BGA packaging. I have been reading up on the processes involved with BGAs and was wondering if you need to apply solder paste to the pads prior to applying heat and mounting the part to the board
