Electronics Forum | Fri Aug 30 00:47:53 EDT 2002 | TLe
Dave, you did not understand my problem right. We don�t get paste on the PCB in the printing phase of process. I have seen also poor wetting on OSP, as you descriped, but that is very unusual. I think generally OSP is better than gold/nickel if spea
Electronics Forum | Tue Sep 03 17:48:34 EDT 2002 | dphilbrick
My customer is finding a blue haze on some SMT pads after processing, kind of looks like a water spot on the surface of solder joints. It requires 20x mag and very good lighting to see. We have done 2 different ionic tests and the boards pass to clas
Electronics Forum | Fri Sep 06 14:35:47 EDT 2002 | bobm
I have been in smt for about 4 yrs. I would say you need to evaluate what type of components you are going to place. How many boards your orders will be for. I use Quad pick and place equipment. These are all around good machines for placing everythi
Electronics Forum | Fri Sep 06 15:22:53 EDT 2002 | barryg
Genny, we recently went through the same scenerio. First to consider is your budget. Second , what type of components (fine pitch, bga, chip components)that you would be placing. Also consider board size max. that you would be doing and would see you
Electronics Forum | Mon Sep 09 21:42:12 EDT 2002 | rwilliams
I have been involved with the reflow process for many years. However, my most recent position now includes the use of Nitrogen. In studying the reflow process and using Nitrogen, it seems to me that it would only make sense to be measuring the O2 lev
Electronics Forum | Fri Sep 13 13:26:34 EDT 2002 | dougt
If it's not blowing the fuse in the car then I guess it wasn't drawing a huge amount of current. Check the power wires going into the radio and look for something loose. My first guess is your loosing voltage across a bad connection somewhere and a
Electronics Forum | Tue Sep 17 15:47:42 EDT 2002 | stepheno
Where I worked previously we had some boards with a couple 15 mil pitch parts. The first batch we got all had undersized pads. We had lots of bridging. We had less bridging with bigger pads. The ball size in the paste makes a bigger diffence regar
Electronics Forum | Wed Sep 18 16:56:55 EDT 2002 | stockley
I started writing a long winded explanation about SMEMA and realised that it is just as easy to write about this as it is to talk about it on the phone. It just so happens that I have recently gone through this process so I believe that your vendor
Electronics Forum | Tue Sep 24 14:38:53 EDT 2002 | Jim M.
The EMS company i work for assembles a small PCB board that requires 10 solid press fit pins installed. The pins are Phosphor Bronze, CDA-510 Alloy, Grade A, 3/4 hard with a finish of .00012 min tin/lead over .00005 min nickel.I would like these pla
Electronics Forum | Fri Sep 27 17:42:35 EDT 2002 | russ
i don't know of any "handy dandy" but something I use is tape width minus 4mm for the max component size that can be fit into tape widths of up to 32mm. 32mm and larger have holes on both sides which would then be tape width minus 7mm. I have never
