Electronics Forum | Tue Sep 28 10:29:28 EDT 1999 | Wolfgang Busko
| Dear all, | | We've got a curious problem. We have had a major problem with BGA's occasionally being placed one to several rows or columns off the pads. We are using Universal's GSM2 platform for our general purpose placements. Our Universal re
Electronics Forum | Tue Sep 28 08:27:55 EDT 1999 | Earl Moon
| if anyone has used or has one of these bga rework stations please give me your opinion on them. I am planning on using the sytem for not only rework but also low volume prototype production for hand built 1 or 2 qty pcb's, so ease of use is impor
Electronics Forum | Wed Sep 29 12:51:55 EDT 1999 | Bob Barr
Never heard of the DRS-22C. I have had a DRS-22 for several years now. Purchased it when we started doing BGA's. The operators like it - good optics (split view), built like a tank, X-Y table easy to manipulate for alignment. I like it because I ca
Electronics Forum | Wed Sep 22 10:03:07 EDT 1999 | Boca
| | | | i'm sure everyone has run into this at one point or another. I have a thin pcb .025 that is single up that has to be built on a pallet. does anyone have any tricks to the pallet design that will help to hold these boards down during the s
Electronics Forum | Fri Sep 17 23:59:40 EDT 1999 | JAX
| | | HI everyone, | | | | | | We are using a Siemens ap-25 screen printer, in the past we have not had any problems with adhesive placement until a couple of weeks ago. It seems the x axis has decided that it should be set somewhere between .00
Electronics Forum | Fri Sep 10 13:25:37 EDT 1999 | Earl Moon
| Currently, I have been requested to measure our SMT productity, capacity levels. I employed "pcs/day" as a base to come out with | indicators for the top management decision-making. Anyone has | other ideas to measure these two items? | | What
Electronics Forum | Wed Sep 08 21:32:46 EDT 1999 | Jason Nipper
| | | | | | Hello: | | | | | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting
Electronics Forum | Sun Sep 12 10:51:04 EDT 1999 | K.T
| | | | | | | Hello: | | | | | | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before put
Electronics Forum | Thu Sep 02 05:19:24 EDT 1999 | JAX
| | I'm in univerity research on SMT assembly systems. Especialy Simulation and Optimisation using OR-Methods. We developed flexible simulation models of various assembly-machines and use them for performance estimation (Components per hour) under di
Electronics Forum | Thu Aug 26 04:35:54 EDT 1999 | Wolfgang Busko
| | | Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products.
