Electronics Forum | Tue Feb 27 11:28:08 EST 2001 | fkurisu
Hello Mark, It is possible that SolderMask, Inc. could selectively remove the existing solder mask, clean and reapply a Photoimageable solder mask to the BGA area. Mostly likely the mask on your boards is a Liquid Photoimageable Solder Mask (LPIS
Electronics Forum | Fri Mar 02 08:52:20 EST 2001 | markkrmp
Are your voids looking like blow holes also? Is this only occurring on the solder joints of the Thru Hole components and Via's? Or does this happen on SMD pads? My experience is that we have seen this but only with some of our older PCB's which are
Electronics Forum | Mon Mar 05 20:53:32 EST 2001 | davef
When you say all over the board, please give more detail. Where are they located? [All over wave soldered portion, laminate only, solder mask only, solder only, specific components only, etc] When you say white residue, what color are they really?
Electronics Forum | Mon Mar 19 00:14:44 EST 2001 | zam_bri
Our process mostly are double sided reflow and we are using water soluble paste on ENTEK PCB. Rework WIP has been accumulated since the last 4 months, and upon clearing, one of the method that the test guy use are to reflow the PCB again for one mo
Electronics Forum | Mon Mar 19 08:56:17 EST 2001 | fmonette
One very important consideration in your situation is to determine if you have moisture sensitive components on these boards. If you have any device classified level 3 or higher then you have a very high level of risk associated with moisture sensit
Electronics Forum | Fri Mar 30 13:06:50 EST 2001 | aortiz
Hi, I need support on the method or applicable standard to measure the shear force strength on chip capacitors and resistors. I know the soldered joints strength is related to land desing, solder volume, pcb and component solderability, component
Electronics Forum | Fri Apr 20 16:11:29 EDT 2001 | davef
Good to talk with you too. Oh, just the way I had it pictured!!! Yeh, right!!! [http://davesmt.50megs.com/pictures select kristenna.jpg ] Which part of the antenna "sees" heat first [Are all legs (vertical part), two legs, or one leg of the anten
Electronics Forum | Thu Aug 24 09:41:46 EDT 2000 | Dr. Ning-Cheng Lee
The optimal profile to choose is determined by the following factors, (1) thermal mass and distribution across the board, (2) reflow temperature range needed for a particular alloy, (3) the nature of flux. When the thermal mass is small, such as cell
Electronics Forum | Thu Jul 20 15:37:53 EDT 2000 | Tekguy2000
These parts are flat chip resistor arrays that have 4 end terminations on each side. It looks liek an IC but is typically in an 0805 and 1206 package type with convex terminations. .031" pitch from termination to termination and .011" spacing between
Electronics Forum | Thu May 03 10:14:10 EDT 2001 | davef
Now, I'm not going to talk solder balls, in a traditional sense. I have an image of bilbous, globs of excess solder near the ends of PTH leads. If that's not what you have, ignore the following [and help us understand your situation better] ... Yo
