Electronics Forum: boarded (Page 396 of 1638)

Re: bowtwist

Electronics Forum | Wed Jul 21 13:12:11 EDT 1999 | John Thorup

| I have pcb's in which i am experiencing warping. | the boards are 12.8125" on a diagonal measurement. | they are out approximatley .010". | the boards are combination thru-hole,smt, they also have 3ounce copper.what is acceptable,and what is the pr

Re: Surface Mounting on Composite Epoxy Materials (CEM - 1)

Electronics Forum | Thu Jul 22 02:58:25 EDT 1999 | George Verboven (Process Engineer)

| We are considering adding surface mount components to a board we currently produce. The board is made from CEM-1. Has anyone had any problems with surface mounting to this material? We use a glue/place/cure process. | | Thanks in advance, | |

Re: glop top popcorn

Electronics Forum | Wed Jun 23 11:02:09 EDT 1999 | John Thorup

| | We are reflowing boards that have glop top components | mounted on them. Do glop tops have the same moisture | sensitivity as fine pitch? Should we be baking the boards | prior to reflow? | |If your glob tops are PBGAs, they are likely very mo

QFP solder paste volume

Electronics Forum | Fri May 21 15:50:41 EDT 1999 | John Thorup

We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendors

Re: vibration during solder reflow

Electronics Forum | Tue May 25 09:19:00 EDT 1999 | Ricardo Lopes

| | Has anyone had any experience or data using vibration during the reflow process. | | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process work

Intrusive reflow..from the bottom..????

Electronics Forum | Thu May 20 15:13:50 EDT 1999 | JohnW

Folk's, One of my 'fellow' engineer's is brining in a new board that his customer has said shouldn't go over the wave..but he want's us to use intrusive reflow on a connector on the bottom side of the board..so since I was standing in the wrong pla

Problems with Ceramic Capacitor SMD In-Circuit Test

Electronics Forum | Wed May 05 20:22:33 EDT 1999 | ADRIANO FERNANDES

I would like to know if someone aleady have problems with Ceramic Capacitors SMD in In-Circuit Test (see below)and how did you solve this problems ? PROBLEMS 1 - Only one kind of capacitor (2n2F), of all capacitors on board, sometimes are open, and

Re: Problems with Ceramic Capacitor SMD In-Circuit Test

Electronics Forum | Fri May 07 13:25:00 EDT 1999 | anirooth

| I would like to know if someone aleady have problems with Ceramic Capacitors SMD in In-Circuit Test (see below)and how did you solve this problems ? | | PROBLEMS | 1 - Only one kind of capacitor (2n2F), of all capacitors on board, sometimes are o

Re: Problems with Ceramic Capacitor SMD In-Circuit Test

Electronics Forum | Fri May 07 15:08:51 EDT 1999 | ANIROOTH

| | I would like to know if someone aleady have problems with Ceramic Capacitors SMD in In-Circuit Test (see below)and how did you solve this problems ? | | | | PROBLEMS | | 1 - Only one kind of capacitor (2n2F), of all capacitors on board, sometim

Re: Via's in BGA pads

Electronics Forum | Wed Apr 21 14:29:58 EDT 1999 | joe devaney

| Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proces


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