Electronics Forum: boarded (Page 61 of 1638)

X outs

Electronics Forum | Thu Jul 25 14:05:12 EDT 2002 | Bordiky

I've been reading the forum here for a few weeks and found some helpful material from talented individuals. Now, I have a question(s). I'm looking into different alternatives for doing X outs. Right now I'm familiar w/ two of them:1. Bad Board Mar

CEM1 PCB

Electronics Forum | Wed Aug 07 08:46:38 EDT 2002 | davef

The time and temperature required for baking moisture from your boards varies according to the conflicting desires to: * Remove enough entrapped moisture. * Desire to retain solderability of solderable surfaces. Search the fine SMTnet archives for s

Fuji cp3 and ip2 placement speed

Electronics Forum | Mon Aug 12 18:26:05 EDT 2002 | pjc

If you are talking actual placement rate- from first fiducial read of board no. 1 to first fiducial read of board no. 2, here is the best I've ever seen based on the boards I've run: CP3- 141 seconds for 468 components per board (all rectangular chi

Bare PCB baking

Electronics Forum | Wed Nov 20 16:53:18 EST 2002 | davef

Q1: How important is the bare PCB baking ? A1: Baking boards is a non-value added activity. Q2: What is the temperature for baking @ what RH ? A2: Search the fine SMTnet Arcives for bake recipes. Q3: What would be the impact for the ENTEK finishe

PCB Baking

Electronics Forum | Fri Feb 28 08:57:34 EST 2003 | davef

We used to bake [100*C for 6 hours] all of our boards, but no longer bake at all. Before going off, your bake recipe is probaly OK. If anything, it's probably too short. Consider measuring the weight of wet boards, baking for a time, measure, bake

BGA Rework

Electronics Forum | Thu Apr 10 10:12:33 EDT 2003 | Claude_Couture

Chrissie, You have my deepest sympathies! But I'm very curious about your business takling a space contract. The quantity of boards that you mentioned hints at a GPS satellite systems, am I correct? In any space quality manufacturing, every step of

No-Lead solder defect - No solder on pads

Electronics Forum | Fri Dec 12 17:19:08 EST 2003 | davef

Here's two angles to think about. Solder goes to the component and not both the board and the component because: * Component lead is much hotter than the the pad on the board. [This probably doesn't apply in your case, because it doesn't repeat fro

reflow oven

Electronics Forum | Mon May 24 17:32:18 EDT 2004 | pjc

Look to the no-Pb solderpaste mfr. specs for on-board temps. For example, Indium Corp. has a product that performs at on-board temps of 229C. Now, your BTU oven will handle this no problem, as will most modern ovens. Its all about thermal mass. Look

Maximum production per SMT Line

Electronics Forum | Fri Jun 04 17:41:17 EDT 2004 | ricardof

Hi to all, I have one question that I hope to receive comments - Does anyone know or have any experience for the maximum boards you can run on a SMT line, this is quite general, but let's consider a board 8" x 8", about 400 components. Regardless of

Looking for expert opinions, Solderability

Electronics Forum | Mon Jul 19 16:26:09 EDT 2004 | davef

Your fab has supplied you with unsolderable boards. They are dewetted, due to some process problem. That they are dewetted on the annular ring of the via indicates that the problem is with the board and not with your paste. [We assume you do not p


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