Electronics Forum: boarded (Page 701 of 1638)

QFN aligment issues

Electronics Forum | Fri Jun 29 15:41:58 EDT 2012 | dontfeedphils

I guess I would atribute it to either board stretch/warpage or someone messed up, whether it be the gerbers aren't quite right or the stencil wasn't cut exaclty as the checkplot was laid out.

Ink marking under conformal coating

Electronics Forum | Mon Jul 02 03:55:07 EDT 2012 | mccabekev

We are having a problem with inspection markings on our boards running when conformal coating is applied We have tried standard permanant markers, and also paint markers, but both run when the coating is applied. There must be someone out there who

Ink marking under conformal coating

Electronics Forum | Mon Jul 02 08:57:21 EDT 2012 | dontfeedphils

It'll probably help to know what type of coating you're using on your boards, how it's being applied, and how it's being cured.

Ink marking under conformal coating

Electronics Forum | Tue Jul 03 03:12:20 EDT 2012 | mccabekev

Unfortunately our customers expect this coating on the boards so that is not an option. There must be something that can mark underneath without washing off. The silk screen doesn't wash off

Ink marking under conformal coating

Electronics Forum | Tue Jul 03 03:13:14 EDT 2012 | mccabekev

Unfortunately our customers expect this coating on the boards so that is not an option. There must be something that can mark underneath without washing off. The silk screen doesn't wash off

baking out pcbs after reflow process

Electronics Forum | Thu Jul 12 02:15:53 EDT 2012 | thmeier

Check also the specs / recommendations of your PCB manufacturer. We bake boards 4h/120°C before reflow and after automated cleaning (it´s not FR4!) and also if we have to rework with the autometd rework- stations (massive IR underheating ,..). Regar

LED on the board

Electronics Forum | Thu Jul 12 05:22:00 EDT 2012 | rob

Hi George, The extra pad is just for mechanical strength, it's not connected. As the Liteon LED is just a side view & nothing special you may get lucky and find that a someone like Rohm, Avago or Osram make something without the centre pad that stil

Pad cratering

Electronics Forum | Mon Jul 23 14:39:11 EDT 2012 | hegemon

I would think that wave solder beneath a BGA component might be a little bit stressful. The board will be expanding much faster than the BGA on the topside. This will cause some stress to the solder joints that might show up as the failure you are

Multilayer Ceramic Capacitor (MLCC) failure root cause analysis

Electronics Forum | Wed Aug 22 12:44:26 EDT 2012 | rway

I would look at your de-paneling process. How are you cutting the boards? This could be inducing mechanical stress on the component; especially if the part is close to the edge of the pcb and perpendicular to it.

Question about Cost

Electronics Forum | Tue Aug 07 07:06:10 EDT 2012 | jdengler

Joe, If you order and take all 1000 boards in one delivery you should be in the $6.00 to $9.00 range for labor only. Jerry


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