Electronics Forum | Mon May 07 11:02:17 EDT 2001 | Singh
Hi all. I am looking into the implementation of the Chip on Board process with eutactic bonding and the then using either gold or aluminum wire to make wedge type wire bonding. Since I am totally new to this, can somebody guide me thru the process,
Electronics Forum | Tue Jun 04 19:33:16 EDT 2002 | rob_thomas
Dave's estimation is pretty conservative but there is a lot of equipment out there and a lot of people happy to make a sale.Implementing both mentioned processes it's difficult and time consuming .Even if you get good training from whoever sells you
Electronics Forum | Mon May 07 15:13:03 EDT 2001 | jdtpfacreate
Singh, The equipment varies in price. We make a wire bonder called the HW27U-H Wire Bonder. This is a gold to gold wire ball bonder. The substrate size you mention is within the area we can take into the machine. The key is the bonding area.
Electronics Forum | Mon May 07 22:29:52 EDT 2001 | davef
4 wire per sec ... you figure how many you need] Encapsulation ~$120K for a dispenser [10 sec per die ... you figure how many you need] plus a cure oven ~$100k Throw in a another ~$100k for marking and cleaning Check the September 2000 SMTnet New
Electronics Forum | Mon Jun 03 12:51:17 EDT 2002 | V.RAMANAND KINI
We are doing COB operations for nearly ten years. Pls. write to me if you need info on m/c selection, type of PCB, plating etc., Thanks V.RAMANAND KINI...03.06.02
Electronics Forum | Tue Jan 23 06:16:13 EST 2007 | Ayelet
Hi, I am lookinh for standards that define the cleanliness level of the assembly room and also for the test and packaging room. I understand that tehre are some defintions of tempertaure and humidity that shoudl be met. Are there any specs for part
Electronics Forum | Wed Feb 07 07:58:58 EST 2007 | ayelet
Thank you guys. So to summarize - no spec, just need to have decent cleaning... Are you familiar with dust events that caused burning of test stations ? Thanks Ayelet
Electronics Forum | Fri Feb 02 11:24:13 EST 2007 | vze3nk2r
is there a level above 100,000 that does not require the use of booties for general assembly work?
Electronics Forum | Tue Jan 23 10:15:44 EST 2007 | slthomas
J-STD-001C just requires that the area not be so dirty as to contaminate your product, tools, workspace, etc. If you start counting particles, you're into cleanroom territory. Do a search on ISO 14644-1 for specifics. Actually Wikipedia does a ni
Electronics Forum | Wed Mar 12 18:30:22 EDT 2008 | genaro_silvera
Hello Steve: I work at Navico, a company that makes GPSs and Sonars among other products for recreational fishing. I want to know if our SMT, Thru-Hole and Final Assembly areas need to be in a cleanroom environment? I've worked in another companies
