Electronics Forum: bond and test (Page 1 of 44)

COB and wire bond

Electronics Forum | Mon May 07 11:02:17 EDT 2001 | Singh

Hi all. I am looking into the implementation of the Chip on Board process with eutactic bonding and the then using either gold or aluminum wire to make wedge type wire bonding. Since I am totally new to this, can somebody guide me thru the process,

COB and wire bond

Electronics Forum | Tue Jun 04 19:33:16 EDT 2002 | rob_thomas

Dave's estimation is pretty conservative but there is a lot of equipment out there and a lot of people happy to make a sale.Implementing both mentioned processes it's difficult and time consuming .Even if you get good training from whoever sells you

COB and wire bond

Electronics Forum | Mon May 07 15:13:03 EDT 2001 | jdtpfacreate

Singh, The equipment varies in price. We make a wire bonder called the HW27U-H Wire Bonder. This is a gold to gold wire ball bonder. The substrate size you mention is within the area we can take into the machine. The key is the bonding area.

COB and wire bond

Electronics Forum | Mon May 07 22:29:52 EDT 2001 | davef

4 wire per sec ... you figure how many you need] Encapsulation ~$120K for a dispenser [10 sec per die ... you figure how many you need] plus a cure oven ~$100k Throw in a another ~$100k for marking and cleaning Check the September 2000 SMTnet New

COB and wire bond

Electronics Forum | Mon Jun 03 12:51:17 EDT 2002 | V.RAMANAND KINI

We are doing COB operations for nearly ten years. Pls. write to me if you need info on m/c selection, type of PCB, plating etc., Thanks V.RAMANAND KINI...03.06.02

Manufacturing and test room cleanliness

Electronics Forum | Tue Jan 23 06:16:13 EST 2007 | Ayelet

Hi, I am lookinh for standards that define the cleanliness level of the assembly room and also for the test and packaging room. I understand that tehre are some defintions of tempertaure and humidity that shoudl be met. Are there any specs for part

Manufacturing and test room cleanliness

Electronics Forum | Wed Feb 07 07:58:58 EST 2007 | ayelet

Thank you guys. So to summarize - no spec, just need to have decent cleaning... Are you familiar with dust events that caused burning of test stations ? Thanks Ayelet

Manufacturing and test room cleanliness

Electronics Forum | Fri Feb 02 11:24:13 EST 2007 | vze3nk2r

is there a level above 100,000 that does not require the use of booties for general assembly work?

Manufacturing and test room cleanliness

Electronics Forum | Tue Jan 23 10:15:44 EST 2007 | slthomas

J-STD-001C just requires that the area not be so dirty as to contaminate your product, tools, workspace, etc. If you start counting particles, you're into cleanroom territory. Do a search on ISO 14644-1 for specifics. Actually Wikipedia does a ni

Manufacturing and test room cleanliness

Electronics Forum | Wed Mar 12 18:30:22 EDT 2008 | genaro_silvera

Hello Steve: I work at Navico, a company that makes GPSs and Sonars among other products for recreational fishing. I want to know if our SMT, Thru-Hole and Final Assembly areas need to be in a cleanroom environment? I've worked in another companies

  1 2 3 4 5 6 7 8 9 10 Next

bond and test searches for Companies, Equipment, Machines, Suppliers & Information



Orange Sticks, Wiring Aids & Probes for Soldering & Desoldering.
MSD Dry Cabinets

Best Reflow Oven
Sell Your Used SMT & Test Equipment

ONLINE IPC Training & Certification