Electronics Forum: bond testing (Page 1 of 14)

West coast testing labs?

Electronics Forum | Fri Mar 23 21:36:02 EST 2001 | CAL

If you do not have any luck finding a west coast lab, but need services I am sure we can help. The only problem is we are on the east coast. Many moons ago empf was on the west coast (China Lake) but moved eastward. We are in Philadelphia, PA. (ski

ICT and specifying PCBA testing

Electronics Forum | Fri Nov 18 12:35:15 EST 2011 | rway

As the article eludes to, you still need probe access to measure the pins with TestJet. One thing I wanted to add was the use of JTAG for use with Boundary Scan. Certain devices have JTAG capability, but not all JTAG devices are Boundary Scan compa

Plating for aluminum wire bonding

Electronics Forum | Tue May 13 21:08:24 EDT 2003 | ramanandkini

Dear Sir, Sorry for the delay in reply. This is regarding MIL standard for bond pull strength: MIL-STD-883C dt.25/08/83 Bond strength (destructive bond pull test); refer table-1 Minimum bond strengths for various wire composition & diameter given.

temperature induced IMC in wire bonds?

Electronics Forum | Tue Nov 15 12:21:20 EST 2005 | arclightzero

Well, I can't speak for them falling off later on, as that's not when I see them, and they are passing their wire pull tests after bonding. What I am seeing is electrical opens during testing, and these opens coincide with the Au/Al bonded points. Th

solder ball shear test question

Electronics Forum | Fri May 17 16:37:28 EDT 2002 | Tom Druan

I was wondering if anyone could direct me towards documentation on shear test methods/apparatus to test the bond integrity of a solder ball to its substrate. Thanks.

gold wire bonding

Electronics Forum | Thu Dec 29 03:57:16 EST 2005 | sparrow

Hello Chris, To be honest, it's hard to believe you could not bond to ENIG at all. Yes, the gold layer is thin and hard, but it just narrows the process window and does not make the bonding impossible. I say this, because we have been using TS gold w

temp stress reliability test for SMT solder bonds

Electronics Forum | Thu Apr 09 12:25:43 EDT 1998 | Dave Hammond

I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whether

glue measurement

Electronics Forum | Wed Oct 10 17:56:35 EDT 2001 | seand

Hello all, My respone here is to add options for evaluation for the engineer. Not to convey that they are the only options as that would be reckless. Cyberoptics does have a standard line of machines configured for in line paste inspection. Some

Shear Testing

Electronics Forum | Tue Jun 01 12:57:52 EDT 1999 | John Sims

I need to perform shear tests on components that have been glued prior to wave soldering. Can any one recommend a shear tester and some standardized info on testing? We have had problems with poor glue bonds and would like to implement a test metho

Solder joint strength

Electronics Forum | Tue Mar 29 14:45:12 EST 2005 | davef

IPC-TM-650 TEST METHODS MANUAL Number Subject: Bond Strength, Surface Mount Lands Perpendicular Pull Method 1 Scope This test method is used to determine the bond strength (breakaway strength) of surface mount lands from substrate materials

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