Electronics Forum: bond wedge enig (Page 1 of 5)

COB and wire bond

Electronics Forum | Mon May 07 11:02:17 EDT 2001 | Singh

Hi all. I am looking into the implementation of the Chip on Board process with eutactic bonding and the then using either gold or aluminum wire to make wedge type wire bonding. Since I am totally new to this, can somebody guide me thru the process,

COB and wire bond

Electronics Forum | Tue Jun 04 19:33:16 EDT 2002 | rob_thomas

Dave's estimation is pretty conservative but there is a lot of equipment out there and a lot of people happy to make a sale.Implementing both mentioned processes it's difficult and time consuming .Even if you get good training from whoever sells you


Electronics Forum | Thu Sep 08 07:04:02 EDT 2005 | davef

Finer pitch: Wedge bonding can be designed and manufactured to very small dimensions, down to 50 mm pitch. Processing speed: Machine rotational movements make the overall speed of the wedge bonding process less than thermosonic ball bonding. Alumin

Have You Ever Meet the Same Problems in Wedge Bonding ?

Electronics Forum | Thu Jul 04 23:17:24 EDT 2019 | 123456789

Today we will talk some other problems you may meet in the wedge bonding work. If you have any other supplement or suggestion, welcome to leave us message. Appear welding spot indentation on the frame, what's the causes? How to solve? 1.The Wedge’s


Electronics Forum | Sun Sep 04 23:42:31 EDT 2005 | juan2208

hi all, i have a question about the wirebonding That is under what circumstances that the ball bonding is used and under what circumstaces the wedge bonding is used? thanx advanced.

gold wire bonding

Electronics Forum | Wed Dec 28 03:33:31 EST 2005 | sparrow

I would like to know if ENIG is widely used for the thermosonic gold wire bonding or this application is an exotic one. And I also wold like to talk to someone who uses printed circuits with ENIG finish for such an application. I do not quite underst

gold wire bonding

Electronics Forum | Thu Dec 29 03:57:16 EST 2005 | sparrow

Hello Chris, To be honest, it's hard to believe you could not bond to ENIG at all. Yes, the gold layer is thin and hard, but it just narrows the process window and does not make the bonding impossible. I say this, because we have been using TS gold w

Large Area Wire/Wedge Bonder

Electronics Forum | Wed Mar 10 15:45:24 EST 2010 | flipit

Looking for a large area wire ball bonder or wedge bonder. Must be able to take 4" X 5" panel and have a bond area of close to 3.5" X 4.4". Also need 6 to 8 wire per second. K&S no longer makes one. Panasonic no longer makes one. ASM does not mak

Regarding the Footprint designing for Wire bonding technology based Microntroller

Electronics Forum | Fri May 29 07:17:02 EDT 2015 | anirudh_thabjul

Hiee everyone, I am a Hardware Engineer and also a PCB designer. I am using a Microntroller which is in "CHIP PACKAGE". So in order to connect our microcontroller with my PCB, i am using "Wire bonding Technology". So, Can any one suggust 1. whi

temperature induced IMC in wire bonds?

Electronics Forum | Tue Nov 15 09:31:27 EST 2005 | arclightzero

I have been reading a good deal about IMC (purple plague in particular) in gold wire/aluminum pad wire bonds. My company uses ultrasonic wedge bonding, and for the most part all of our bonding is gold/gold, however we have one particulr part that has

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