Electronics Forum | Wed Oct 15 09:53:01 EDT 2003 | markhoch
These boards also were above liquidus for 75 seconds, and the customer puts the boards thru extensive thermal shock and stress testing. An Alpha Applications engineer told me that because the boards were above 183 degrees for 65-75 seconds that the i
Electronics Forum | Tue Nov 11 16:01:09 EST 2003 | KSimpson
Adam, As for stripping the boards.. get them right to start with. Believe me you don't want to clean them. If you have to remove the coating most conformal coating brands offer a removal agent that has been tested on most all component ranges. IF yo
Electronics Forum | Sun Nov 30 08:53:15 EST 2003 | davef
IPC-6012A finds "circuit repairs" as acceptable in Class 1, 2, and 3 only "As agreed by user and supplier." So, it is your call, basically. Generally these repairs, if done properly, are reliable. See IPC-7721, 5.2.3, for conductor repair by welding
Electronics Forum | Thu Mar 04 22:57:32 EST 2004 | Ken
I have an Aqueous Technologies stencil cleaner and I can see many SAWA advantages over the "larger" machines. 1. Floor space savings 2. Chemical cost (up to 30 dollars a gallon) 3. Hand ultra sonic cleaning could never destroy the webbing and bon
Electronics Forum | Mon Oct 25 17:50:46 EDT 2004 | Mike
I work for a PCB Manufacture and I am looking for info on BGA Pull test or strenght test. I have a CM that is experiencing bga's with some weak joints. they are telling me that when they do their pull test the joints are breaking at the nickel inste
Electronics Forum | Wed Mar 02 18:46:02 EST 2005 | Austinj
The tendancy always has been "when in doubt, touch it up"... this is not the way to "verify the process" and is not the best strategy for multiple reasons (unessecary rework, additional labor costs, as well as making the solder joint more brittle, [i
Electronics Forum | Wed Sep 07 10:41:24 EDT 2005 | D.B. Cooper
We've seen the same thing - leads of QFPs not as strong as we'd like them to be. In the past 4 years no problem, this Spring they start failing. Touch a solder iron to it and it solders fine. After crunching some data, we found that both QFPs fail
Electronics Forum | Thu Mar 30 12:38:14 EST 2006 | Tech
Also why I am at it. In the book CP-6 Series Maintenance Manul ( Fuji Part # MNT-C060-11.3E ) in Chapter 4 page 4-1-11 it says " The clutches should therfore be cleaned regularly, using the grease cleaner (ThreeBond 2706) provided with the machine."
Electronics Forum | Tue Mar 21 19:34:32 EST 2006 | Tom Smykowski
Omar: I dealt with this so called "hot bar" process also, and you're right; it's neither reliable nor repeatable. The goal was to attach a flex LCD display to another flex circuit. The flex LCD was constructed of resin and conductive silver particl
Electronics Forum | Wed Jun 21 13:25:16 EDT 2006 | muse95
I see what you're saying - I'm not a process guru by any means. I was going on the premise that SAC melts at a higher temperature than SnPb. Basically I think of it as a BGA is joining solder to solder, unlike an SOIC where it is tinned metal lead t
