Electronics Forum: bonder (Page 1 of 9)

flip chip bonder

Electronics Forum | Wed Sep 23 20:38:30 EDT 1998 | parag

does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap.

Re: flip chip bonder

Electronics Forum | Thu Sep 24 13:17:34 EDT 1998 | Dave F

| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Parag: Check the link bel

Re: flip chip bonder

Electronics Forum | Thu Sep 24 07:43:12 EDT 1998 | Earl Moon

| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Characterization means det

Installation and after-sales service of Samsung bonder

Electronics Forum | Mon Nov 14 02:40:38 EST 2022 | cooper

We are looking for companies in Europe who can provide Samsung mounter installation and after-sales service with generous compensation, interested companies please contact us. Cooper Sales Director Shenzhen Jaguar Automation Equipment Co., Ltd TEL

Training Request on ASM Eagle Xtreme gold wire bonder

Electronics Forum | Thu Feb 15 18:35:10 EST 2024 | prestonames

Hi Mahmoud, I hope you were able to find a solution for your project! My company recently purchased an ASM Eagle Xtreme Gold Wire Bonder and we have been unable to locate the manual. Is it possible to share the manual that you have over email? Pleas

Training Request on ASM Eagle Xtreme gold wire bonder

Electronics Forum | Fri Feb 16 15:12:27 EST 2024 | capse

ASMPT SEMI USA, Inc. 7850 S Hardy Drive, Suite 110, Tempe, AZ 85284-112 U.S.A. Phone: +1 602 437 4760

Training Request on ASM Eagle Xtreme gold wire bonder

Electronics Forum | Tue Jul 18 16:49:49 EDT 2023 | mahasg

Hello All, I am PhD student at polytechnique Montreal. We have a CQFP44 packages and Dies of 51um pad pitch (22nm FDSOI tech) that I need to bond myself at the university using ASM Eagle Xtreme gold wire bonder in the university. we need to perform b

Universal 4684A TAB Bonder: Wanted

Electronics Forum | Tue Jun 05 15:56:22 EDT 2007 | adlsmt

Can you use a 4682 fine pitch bonder?

Universal 4684A TAB Bonder: Wanted

Electronics Forum | Wed Jun 06 19:17:43 EDT 2007 | bryanhanton

4682 "baby bonder" not suitable. Thank you for your reply. Best Regards Bryan

reflow profile

Electronics Forum | Sat Sep 22 14:33:50 EDT 2001 | Tony

I like to secure the thermalcouples with a small dot of chip-bonder(surface mount adhesive). The chip-bonder will cure durring the first pass through the oven. After I have developed my profile I remove thermalcouples and the chip-bonder with a solde

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