Electronics Forum: bonders (Page 1 of 9)

Universal 4684A TAB Bonder: Wanted

Electronics Forum | Tue Jun 05 15:56:22 EDT 2007 | adlsmt

Can you use a 4682 fine pitch bonder?

Universal 4684A TAB Bonder: Wanted

Electronics Forum | Wed Jun 06 19:17:43 EDT 2007 | bryanhanton

4682 "baby bonder" not suitable. Thank you for your reply. Best Regards Bryan

reflow profile

Electronics Forum | Sat Sep 22 14:33:50 EDT 2001 | Tony

I like to secure the thermalcouples with a small dot of chip-bonder(surface mount adhesive). The chip-bonder will cure durring the first pass through the oven. After I have developed my profile I remove thermalcouples and the chip-bonder with a solde

flip chip bonder

Electronics Forum | Wed Sep 23 20:38:30 EDT 1998 | parag

does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap.

Skewed transistors

Electronics Forum | Fri Apr 18 18:11:38 EDT 2003 | slthomas

"glue the floater in place with chip bonder before reflow" gets my vote. We have decals for DPAKs and TO-252's that don't match either specification, and chip bonder is the only answer if they won't spin the board for you.

ASM Bonder

Electronics Forum | Sun Nov 06 14:12:07 EST 2005 | Danmens

I am looking for someone very familiar with ASM wire-bonders (AB356) to train us after hours on a temporary basis. You must reside in MA, NH or RI. Send an e-mail if you are interested. dmendoza@mnc.com

Universal 4684A TAB Bonder: Wanted

Electronics Forum | Sat May 26 02:50:15 EDT 2007 | bryanhanton

Hi. Currently we are in the market for UIC 4684A TAB Bonder. If anyone would like to sell such equipment, or knows where a machine or machines are located, please leave details. Best Regards Bryan Hanton

Large Area Wire/Wedge Bonder

Electronics Forum | Wed Mar 10 15:45:24 EST 2010 | flipit

Looking for a large area wire ball bonder or wedge bonder. Must be able to take 4" X 5" panel and have a bond area of close to 3.5" X 4.4". Also need 6 to 8 wire per second. K&S no longer makes one. Panasonic no longer makes one. ASM does not mak

COB and wire bond

Electronics Forum | Mon May 07 15:13:03 EDT 2001 | jdtpfacreate

Singh, The equipment varies in price. We make a wire bonder called the HW27U-H Wire Bonder. This is a gold to gold wire ball bonder. The substrate size you mention is within the area we can take into the machine. The key is the bonding area.

Universal 4684A TAB Bonder: Wanted

Electronics Forum | Tue Jun 05 13:50:56 EDT 2007 | bryanhanton

Finder's Fee negociable for this equipment

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