Electronics Forum: bonding (Page 11 of 64)

Why gold plating on PCB?

Electronics Forum | Sun Apr 05 00:23:53 EDT 2020 | researchmfg

1. To protect the nickel and copper under gold plating from oxidization before soldering. Gold plating can extend the PCB self-life and improve the solderability for 2nd re-flow. 2. Provide a good bonding strength. For Chip on Board process that Gol

COB and wire bond

Electronics Forum | Mon May 07 15:13:03 EDT 2001 | jdtpfacreate

Singh, The equipment varies in price. We make a wire bonder called the HW27U-H Wire Bonder. This is a gold to gold wire ball bonder. The substrate size you mention is within the area we can take into the machine. The key is the bonding area.

Re: Help-Wire Bonding Defects Analysis After Encapsulation

Electronics Forum | Fri Nov 27 08:07:50 EST 1998 | Earl Moon

| | | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is

Silicone for bonding?

Electronics Forum | Mon Oct 06 09:51:13 EDT 2003 | davef

We ban silicone from our shop. It makes connections unsolderable.

COB Wire Bonding Capabilities

Electronics Forum | Wed Feb 09 16:43:51 EST 2005 | George

Thank you Dave.. Your the best. How you know this stuff is beyond me.

wirebonding

Electronics Forum | Wed Sep 07 17:14:11 EDT 2005 | GS

finest pitch requires ball bonding (gold) GS

reflow oven problem

Electronics Forum | Sat Jan 06 08:29:08 EST 2007 | davef

There may be a coating on the components that fell-off that prevents the glue from bonding well to those components.

Die bonded at an angle in a QFN component

Electronics Forum | Fri Jul 17 21:54:18 EDT 2020 | davef

That is unusual. Is it a once-off or SOP for that part?

Training Request on ASM Eagle Xtreme gold wire bonder

Electronics Forum | Tue Jul 18 16:49:49 EDT 2023 | mahasg

Hello All, I am PhD student at polytechnique Montreal. We have a CQFP44 packages and Dies of 51um pad pitch (22nm FDSOI tech) that I need to bond myself at the university using ASM Eagle Xtreme gold wire bonder in the university. we need to perform b

COB and wire bond

Electronics Forum | Mon May 07 22:29:52 EDT 2001 | davef

4 wire per sec ... you figure how many you need] Encapsulation ~$120K for a dispenser [10 sec per die ... you figure how many you need] plus a cure oven ~$100k Throw in a another ~$100k for marking and cleaning Check the September 2000 SMTnet New


bonding searches for Companies, Equipment, Machines, Suppliers & Information