Electronics Forum | Wed Feb 14 14:17:41 EST 2001 | Glenn
Does anyone know of any vapor phase oven manufacturers? The application requires bonding a 3-D object at various joint surfaces using eutectic solder. The vapor zone shall require approximately 10 inches of height. The available SMT vapor phase ov
Electronics Forum | Mon Dec 18 22:36:37 EST 2000 | Charles Harper
The major problems are poor layer to layer bond strength(due to surface tension of most fluoropolymers),and poor cold flow,or dimensional creep of these materials.Please also click on Chapter Author Konsowski,listed above.E-mail form will pop up when
Electronics Forum | Wed Dec 20 10:17:10 EST 2000 | markt
What steps are presently being taken by manufacturers to deal with problems such as layer bond strength, cold flow, and dimensial creep at present? Are there substantial materials research efforts, that you are aware of, in progress that address thes
Electronics Forum | Tue Jun 06 13:19:31 EDT 2000 | ZAKIR AHMAD
Our company do electronic packaging for space applications. One of the problems we face during our design is whether or not to stake/bond the surface mount components to the board to survive the vibration qualification environment. If we do staking
Electronics Forum | Mon Jun 03 12:51:17 EDT 2002 | V.RAMANAND KINI
We are doing COB operations for nearly ten years. Pls. write to me if you need info on m/c selection, type of PCB, plating etc., Thanks V.RAMANAND KINI...03.06.02
Electronics Forum | Mon Jun 18 11:06:31 EDT 2001 | Gil Zweig
In-line systems are effective in detecting the obvious defects such as solder bridges, missing balls and excessive solder voids. They may not be as effective in detecting the subtle changes in solder bond shapes (signatures) indicating loss or chang
Electronics Forum | Mon Jun 18 18:17:10 EDT 2001 | davef
What to you consider to be the minimum resolution [micron] for: General, BGA, die attach uBGA, flipchip, wire bonds Wire cracks, delamination Microcircuit failure What is the relationship between resolution [micron] and the kV of the tube?
Electronics Forum | Tue Jul 31 06:33:58 EDT 2001 | nifhail
What is the industry standard specification for Resisitivity monitoring at aqueous cleaning? What would be the diff. between specs. for normal PCBA vs PCB that has to go through wire bonding after SMT for COB process. pls advise..thx
Electronics Forum | Tue Nov 30 13:20:07 EST 1999 | John Thorup
Hello Wolfgang Try looking in the process guides section of Circuit Technologies web site. Their recomendation is to bond the jumper wire to the board within 6mm of the lead with hot melt glue, cyanoacrylic glue or adhesive dots. John Thorup
Electronics Forum | Wed Nov 24 01:31:11 EST 1999 | James Bond
Dear Mr. Curtis, We have alternative solution for your problem, if epoxy paste is for bonding purpose. Please visit our Website to get more details as follows. http://www.squeegee.co.kr Best regards, J.B. Hyun
