Electronics Forum: bonding (Page 51 of 64)

Differentdefect on circuit board surface

Electronics Forum | Fri Jul 10 07:34:00 EDT 2020 | elijah

From the poor bonding strength of the board, the surface quality problems of the board are divided into: 1. The cleanliness of the board surface; 2. The problem of micro graphite (or surface energy) on the surface. PCB circuit board proofing Youke bo

Re: Poor solderability

Electronics Forum | Thu Feb 10 22:41:20 EST 2000 | Dave F

Russ: Now that�s a good story. Nuff said on the Vegas trip, that explains everything. Especially when you say "it must have something to do with ..." I love WS609. It�s been berry, berry good to me. Intermetalic Layer (IL). A compound formed a

Re: PCB delamination

Electronics Forum | Mon Feb 05 17:18:53 EST 2001 | davef

Wha, Nellie!!! Delamination & Blistering IPC-A-600D Although it may occasionally occur because of a severe process breakdown, delamination and blistering occurs as a result of an inherent weakness of the material. Either condition represents a brea

Re: BGA problem: open after reflow

Electronics Forum | Fri Jan 19 17:43:30 EST 2001 | davef

Intermetalic Layer (IL). A compound formed at the interface of two different metals, whose atoms have an extremely high natural attraction for each other, so high, that they do not bond to other elements by any other means. Also, intermetalic compo

Re: Reliability of Reworked Pads/Traces?

Electronics Forum | Wed Mar 29 09:31:28 EST 2000 | Erick

Marc: My experience found reliability IS a function of operator skill and attension to the process. Expecially for some RF assemblies. I worked with an engineer from Rogers to develope a process for reworking Pads for a special material. (I thing

Non-wetting on 0402 chips capacitors

Electronics Forum | Wed May 09 17:26:57 EDT 2001 | davef

Awww, don beso tuff on ursef!!! It sounds like you�re thinking correctly with what you�ve done, but it�s possible that the test you ran did not represent your actual production environment as well as you would have liked. So, you just need to "cran

Gil

Electronics Forum | Mon Jun 18 15:42:32 EDT 2001 | Gil Zweig

Transmission x-ray inspection is the technique most people are familiar with. Since materials will absorb or transmit x-rays as a function of their atomic number and thickness, the transmission x-ray image provides a two dimensional represenation of

ERSA scope?

Electronics Forum | Sat Aug 18 23:40:22 EDT 2001 | CAL

We at ACI have both endoscopes and xray. We have used the ERSA Scope often and it is a great machine, but the cost is hard to justify the ROI.The ERSA Scope is in the $28K to $32K range. I had a chance to see OC Whites Endoscope and it was cool.Pric

Re: Poor solder joints on QFP 100's

Electronics Forum | Thu Dec 16 16:46:47 EST 1999 | Mike Naddra

Steve , I use a general set of guidlines when developing reflow profiles: Ramp rate to 140 deg C - 50-60 seconds Time at preheat (140-160 deg C) - 90-120 sec Time above liquidous (183 deg C) - 45-90 sec Time at peak (215-225 deg C) - 9-12 sec peak t

Re: Proflow of DEK screen printer

Electronics Forum | Sat Sep 04 09:31:35 EDT 1999 | Earl Moon

| | | Dear sirs, | | | | | | If you have experienced Proflow of DEK screen printer, please let me know the details of it. | | | | | | Best regards, | | | | | | Jame Bond | | | | | | | | James, | | | | Stir, don't shake is not good advice for c


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