Electronics Forum | Thu Jun 25 14:32:14 EDT 1998 | Alon
| | | | Is anyone aware of any papers/publications dealing with the topic of selective soldering of through-hole parts on SMT pcb's..? | | | I would also be interested in a good reference book dealing with wave soldering. | | | Contact me if you hav
Electronics Forum | Thu Jun 18 17:16:49 EDT 1998 | Bill Christian
I am looking for a quickly obtainable procedure on the repair of SMT boards. I am particularly interested in discrete components, such as capacitors and resistors. I need to know the importance of pre-heating the board and components. What is a good
Electronics Forum | Tue Jun 16 22:19:24 EDT 1998 | Ben Salisbury
The company I work for has only 1 SMT line all FUJI 89 vintage, My expierience with the Industry started with this line when it was brought into the company 2 years ago, from day one I've been the Process tech for the line and have learned a great de
Electronics Forum | Thu Apr 09 00:07:54 EDT 1998 | Bonnie
I am in urgent need of a pcb land patten (footprint)for this device. I have the component data sheet with with package dimensions from Motorola, but they do not include the recommended land pattern. I requested a patten over a week ago, but have no
Electronics Forum | Thu Apr 09 00:12:02 EDT 1998 | Bonnie
| I am in urgent need of a pcb land patten (footprint)for this device. I have the component data sheet with with package dimensions from Motorola, but they do not include the recommended land pattern. I requested a patten over a week ago, but have
Electronics Forum | Wed Feb 18 13:34:48 EST 1998 | David Cooke
I am currently researching SMT for an essay which counts towards my Elec Eng degree course. Unfortunately the deadline is Friday 20th Feb and as yet I have found little information on which to base my essay as other students have loaned out all of th
Electronics Forum | Wed Feb 18 13:49:15 EST 1998 | Phil Szypko
| I am currently researching SMT for an essay which | counts towards my Elec Eng degree course. | Unfortunately the deadline is Friday 20th Feb and | as yet I have found little information on which to | base my essay as other students have loaned out
Electronics Forum | Wed Feb 18 13:47:55 EST 1998 | Phil Szypko
| I am currently researching SMT for an essay which | counts towards my Elec Eng degree course. | Unfortunately the deadline is Friday 20th Feb and | as yet I have found little information on which to | base my essay as other students have loaned out
Electronics Forum | Sat Feb 14 13:28:47 EST 1998 | ASHOK DHAWAN
I am beginer in BGA assembly and am confused in selection of pick and place option. As per book on 'implementation of BGA Technology-by 1995 aeic inc. states that BGAs reflow is quite forgiving and you need only Mechanical centering of PBGAs. The IPC
Electronics Forum | Mon Aug 27 15:03:40 EDT 2001 | davef
Essentially, you want to ruggedize this component. Various adhesives could work great, depending on the source of the energy that is causing the solder connection fatigue. So, what are your looking to: * Rigidly bond the component to the board? * A
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