Electronics Forum: bookshelf (Page 1 of 1)

Immersion Gold over Nickle de-wetting problem

Electronics Forum | Tue Mar 11 12:20:13 EST 2003 | Jim

Look at "Dave's Book Shelf" here: http://www.smtinfocus.com/bookshelf/bookshelf.html

Accidental solder mask

Electronics Forum | Wed Dec 18 09:04:29 EST 2002 | russ

Dave, You stated that an unfilled via is of greater strength than a filled or partially filled via. I posted to another thread recently and I stated that a filled via was of greater strength than an unfilled. I was tought (incorrectly?) that a fill

Accidental solder mask

Electronics Forum | Wed Dec 18 10:10:07 EST 2002 | davef

No, sorry not on "Dave's Bookshelf". My basis is a study done at IBM. I reference it here: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=4941&#Message19050 Responding differently, you're correct. If you have a

SMD ASSEMBLY & TEST EBOOKS NEEDED

Electronics Forum | Thu May 29 00:26:58 EDT 2008 | bobwillis

Bob Willis' Top Ten Reference Books Here is a new list of "Bob Willis' Top Ten" reference books that has been updated for 2007 to take into account recent changes in technology. In the publishing industry there are many charts and awards for the bes

Re: Why does everyone want to x-ray BGA?

Electronics Forum | Thu Jul 01 00:51:56 EDT 1999 | Scott Cook

Steve, First of all I don't disagree with you, but 104 caps perform a power smoothing function not a data signal function. A PCB will still function despite a few dead cap locations. It won't function without certain IC lead contact

Re: Who Are The X-Men?

Electronics Forum | Fri Oct 16 09:12:46 EDT 1998 | Scott Cook

Sorry folks. I'm just a naysayer here. Let's look at this BGA thing...... We've all been successfully processing down to 16 mil FP stuff for years, now--some of us down to 11 mil. Once the printing process was stabilized, paste rheologies were matur

Re: Who Are The X-Men?

Electronics Forum | Sat Oct 17 10:43:29 EDT 1998 | smd

Sorry folks. I'm just a naysayer here. Let's look at this BGA thing...... We've all been successfully processing down to 16 mil FP stuff for years, now--some of us down to 11 mil. Once the printing process was stabilized, paste rheologies were

soft gold vs immersion gold

Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef

90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125

Books for SMT

Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef

DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b

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