Electronics Forum | Tue Dec 26 12:35:09 EST 2000 | Dave F
Your English is fine. Your assessment that corrosion on a portion of the metalization on the end of a component is causing the tombstoning is reasonable. We've seen that before. Corroded components received from a supplier is not acceptable as an
Electronics Forum | Wed Oct 17 09:38:55 EDT 2001 | fmonette
Dear Daniel, I assume that these components are moisture-sensitive. If they have absorbed too much moisture prior to reflow you might be experiencing popcorning. This typically shows up as a bulge over the surface of the die, in the center of the p
Electronics Forum | Wed May 06 19:51:46 EDT 1998 | D.Lange
| Dear Freinds, | DOES ANY ONE OF YOU WILL BE KIND ENOUGH TO GIVE SOME INPUT ON DOUBLE SIDE REFLOW OF COMPONENTS WHAT ABOUT BOTTOM SIDE COMPONENT HOLDING DURING 2ND SIDE REFLOW? ANY IDEA OTHER THAN USING SLDERPASTE WITH OFFSET MELTING POINT, EPOXY DI
Electronics Forum | Mon Oct 04 04:01:10 EDT 1999 | Chris May
| What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | How about curing bottom side first and reflowing top side later? | | What percentage of companies run reflow/cur
Electronics Forum | Tue Jan 16 18:00:50 EST 2001 | mikestringer
Hi everyone I am in the process of reviewing our storage of SMT components. At the moment they are pretty much on open shelves in the factory environment. We endevour to reseal components labled 'moisture sensitive' in their original packaging, bu
Electronics Forum | Wed Feb 16 08:15:32 EST 2005 | GS
Thank you Dave, that is almost the asnswers we use to give to our Customers when auditing they ask for component shelf life. But as you can imagine, they whant to see a quick information right on the label (on Reels, on trays, etc) like: Use b
Electronics Forum | Tue Sep 09 11:53:36 EDT 2008 | davef
We consider "IR-reflow soldering profile" to be the supplier's recommended reflow thermal profile that a component temination 'sees' for proper soldering, regardless of the method used to reach that temperature. When you say, "We have a lot of defec
Electronics Forum | Fri Jul 04 03:22:31 EDT 2014 | sramos
Thanks Rob for your meaningful advice. Instead of just a general average time per component, I think if we have 3 averages, 1 per "component group", we will gain significant accuracy in the cost model. For instance, a motherboard may have 2500+ R and
Electronics Forum | Wed Mar 22 14:59:20 EDT 2017 | solderingpro
Hello Henry, I believe some further clarification may be needed for someone to assist. Is the component already soldered prior to reflow? Does the component have paste already applied going through reflow? (or as per my previous question, is it al
Electronics Forum | Fri May 12 09:24:45 EDT 2000 | Ashok Dhawan
I need to install two SMD chips (0805) at one location. I refered to IPC-HDBK-001, fIG 6-24. When I solder the chips side by side, the ceramic side which is placed againgst solder pad- is already touching the solder. While I complete the solder joint
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