Electronics Forum: bottom terminated components (Page 86 of 124)

Zevatech 740 RH Head - issues with rotation of component during laser recognition

Electronics Forum | Tue Mar 13 19:27:33 EDT 2018 | maustin

I have an old Zevatech 740 machine that, until recently, was running well. In the last few weeks, the RH head has started giving me issues. When it picks up a component (and early on in most of my programs it will be picking up chip resistors or ca

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Wed Dec 21 17:11:47 EST 2005 | Mike Dolbow www.atotalgps.com

Has any one considered the melting eutectic of the plated part verses the eutectic of the paste it self. Inter metallic solids can form when mixing metals. Thus this causes solder joint reliability. Also a lot of vendors are putting out pure tin prod

Re: Wave Soldering Temperature Profile

Electronics Forum | Thu May 06 18:06:43 EDT 1999 | JohnW

| | Can anyone pls email me a typical temperature profile for wave soldering process. | | | | Thank you vey much. | | | | rdgs... | | | Typical depends on the processes you're developing. | | Key factors in my experience are flux type and requi

Re: Wave Soldering Temperature Profile

Electronics Forum | Thu May 06 18:07:59 EDT 1999 | JohnW

| | | Can anyone pls email me a typical temperature profile for wave soldering process. | | | | | | Thank you vey much. | | | | | | rdgs... | | | | | Typical depends on the processes you're developing. | | | | Key factors in my experience are f

SMT Component rotation problem

Electronics Forum | Thu Feb 27 15:13:35 EST 2003 | stockley

Oh dear, I tried not to respond but i couldn't help myself. Stop me if I go off into the woods. My guess, Chris, based on your fleeting reference to GF files, is that your SMT machines are Siemens Siplace. If this is so then package orientation def

Re: How to do with tombstoning for component '0402'

Electronics Forum | Mon Nov 06 10:29:28 EST 2000 | Dean Stadem

All of the replies have merit. Here is another one. Because the cause of the tombstoning is wetting forces that are imbalanced, and one end wets faster or more readily than the other, the 0402 lifts up on that end easily because of its low mass. Incr

Re: Wavesoldering

Electronics Forum | Tue Oct 24 12:20:35 EDT 2000 | JohnW

Adam, Did some work on this a bit back via some good old Taguchi DOE and like Dave(the guru)F say's your component terminations is a big factor but I also foundthat the amount of flux you put on as well as the preheat's has an effect, generally we f

Insert Molded Terminal Selective Soldering

Electronics Forum | Mon Feb 26 19:56:24 EST 2001 | davef

SMTnet Archives used to have copious amounts of information on a pin-in-hole [e.g., pin-in-paste, paste-in-hole, etc] reflow process, but much of that appears lost with the conversion to the new and improved site format. In getting started, check:

IPC-7912 DPMO

Electronics Forum | Tue May 08 19:28:29 EDT 2001 | mparker

Received my copy of the standard about a month ago. Seems straightforward and gets away from the percentage nightmare. Mark Twain said it best with "There are 3 kinds of lies in this world - lies, damn lies and statistics!!" Now I have some nagging

Re: 0402's Tombstoning

Electronics Forum | Thu Oct 14 18:02:31 EDT 1999 | JohnW

Bryan, 0402's tombstonning isn't that uncommon and usually the 1st reaction is alway's the pad size aint right. If you've followed the IPC guidline's normally you should be fine but I'd double check the component supplier's spec's as well. brian's p


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