Electronics Forum | Mon Dec 15 16:08:41 EST 2008 | dyoungquist
We have been running double sided surface mount pcb assembly for several years with no adhesive needed. We paste, place and reflow one side, then repeat the process for the other side. With Rs, Cs and small to medium ICs we have no problem with par
Electronics Forum | Fri Dec 01 01:42:09 EST 2000 | PeteC
I recommend paste print-reflow the bottom side then use a selective wave solder pallet to mask the SMT components on the bottom side. PeteC
Electronics Forum | Fri Oct 26 07:55:49 EDT 2001 | Kenny
Does anybody know how I work out how heavy a part I can have on the bottom side of the board while reflowing top. Obviously there is a tie between the footprint in the paste and the surface tension of solder paste, but what is it ?
Electronics Forum | Wed Aug 28 19:35:13 EDT 2002 | ppwlee
Hi, Does anyone have guidelines on minimum SMT component spacing for bottom sided wave soldering? I am looking for general rule of thumb in wave soldering bottom side SOTs, 0805 & 0603s. How about minimum through-hole lead to pad distance? Peter
Electronics Forum | Wed Aug 28 19:36:29 EDT 2002 | ppwlee
Hi, Does anyone have guidelines on minimum SMT component spacing for bottom sided wave soldering? I am looking for general rule of thumb in wave soldering bottom side SOTs, 0805 & 0603s. How about minimum through-hole lead to pad distance? Peter
Electronics Forum | Sat Nov 09 08:04:52 EST 2002 | erhard
if you wave solder you have to glue the SMD parts on the bottom side. If you reflow the bottom side then you usually shouln't go over the wave afterwards. It's quite logical the joints melt again, that's what you want to achieve going over the wave.
Electronics Forum | Tue Feb 08 14:14:23 EST 2005 | Jim V.
Looking for suggetions on improving the bottom side connection on MSOP package. What is the common paste / pad / stencil aperture practice?
Electronics Forum | Fri Jul 08 18:48:50 EDT 2005 | mdang
Hi, We are a Contract Manufacturing and have a project which has a few Xilinx BGA on top and bottom side. Does anyone run a cross this or have any suggestion on how to reflow them. Thank you, -Michael
Electronics Forum | Tue Dec 19 04:04:52 EST 2006 | ec
Hi, I been facing this problem in the past...... Now, I have change to printing. In the past, glue dotting is my bottom neck and need to use 2 glue dotting machine....and now, with printing proces, no more bottom neck in glue process and quality als
Electronics Forum | Tue Feb 27 14:30:07 EST 2007 | jgill
I have a small board with two through hole and two SMTs. Is it easier to manufacture with the SMTs on the top or bottom? Thanks, John
