Electronics Forum | Fri Feb 22 16:49:44 EST 2008 | pms
Steve, Trying to keep wave solder from coming up the via' from the bottom and adhering to the via's and via's pads during wave. We use WS flux thru-out the whole process. I have been concerned about possible flux intrapment in the via's. That's a g
Electronics Forum | Wed Apr 16 15:44:35 EDT 2008 | jwolvans
Just a thought: if nothing else makes sense, you might want to watch the action of the edge-hold chains of the reflow oven, are they moving smoothly and uniformly around the drive gears and idlers? I've actually seen the situation where the chains we
Electronics Forum | Tue Apr 15 03:16:14 EDT 2008 | janz
Hello, We are having a problem with soldering QFP100 (16mmx16mmx1mm). Board dimensions: 70mmx50mmx1.8. FR4 two layers � single SMT assembly. Finish: HASL-lead free Oven: 7 zones �hot air Paste: lead free We have noticed that two groups of legs
Electronics Forum | Thu May 01 08:35:11 EDT 2008 | cyber_wolf
We are having issues with these parts tilting to one side during reflow. Of course when they are tilted, they have to be reworked because the shield won't fit on. Changing board design and part design is not an option.... I think there are 2 reasons
Electronics Forum | Tue Jun 03 01:03:04 EDT 2008 | daxman
Hi, I think what you are describing is a half-etch QFN, which causes the 3 mil gap. In our process, we don't require solder to bridge this gap as it's internally connected to the bottom lead. I'm not sure if this is the question you're asking, but
Electronics Forum | Tue Jul 08 22:44:06 EDT 2008 | proy
I made progress and almost acceptable results by adding heat to the bottom of zone 4 HOWEVER, the core problem I uncovered last night/this morning was that the #4 top side blower had failed. I think this is the key why I was having so much trouble.
Electronics Forum | Mon Aug 11 09:59:40 EDT 2008 | John S.
Guys, We're seeing what looks like an issue where through hole solder joints from our ive solder process are cracking during the cooling phase of the soldering process. This was detected during thermal shock testing, and we have tracked it back to a
Electronics Forum | Wed Aug 27 08:46:14 EDT 2008 | vladig
Hi Sean, It's an old problem with no definitive cure for now. However, there are a couple of things to look for. First of all the location(s) of HoP. If it was due to the componetn warpage, then it would be most probably in the middle and it should
Electronics Forum | Fri Oct 10 13:53:27 EDT 2008 | ccouture
Has anybody ever use this method to reclaim the solder from dross. I tested this $10 gadget, it's used to press potato to make mash potato. The result is comparable to a $20k machine that basically does the same thing, i.e.: compress dross to squeeze
Electronics Forum | Sun Oct 19 15:02:10 EDT 2008 | Jdt13
We are having some issues with a RF PCB aprox 1" x 1". The pads are in the bottom of the PCB and it goes on the Top side of the mother board the pads of the RF board are like a BGA (square pads)and we have troubles to make the proper welding in the
