Electronics Forum | Wed Aug 16 03:48:24 EDT 2006 | umar
Hi All SMT Net Team Member, I always have problem at MY SMT process and production side, Every time product running at my production side always found a lot solder Ball issue near the pad of SMT chip component. We had quite hard to do the trouble s
Electronics Forum | Mon Aug 21 08:34:09 EDT 2006 | Chunks
Larry, You always seem to twist things back to your wave solder process, ya nut! Anyway, why over simplify things when you are trouble shooting a process? The K.I.S.S. process was invented by your generation so I thought you of all people would l
Electronics Forum | Mon Aug 28 18:16:17 EDT 2006 | fastek
Sure Base....go ahead and trust your company's livelihood to make money on a vendor that is either going out of business or is on the block to be sold. These are not cars or luxury items of convenience we are talking about here. In many if not all c
Electronics Forum | Sat Oct 28 02:25:19 EDT 2006 | mika
Agree!! Where is Your thermocouple-probes attacded and can we get the info from this? Delta-T of the comp. is very, very important! The single most important smt-process step is the profiling/recipy and as a result of this, this poor package will cor
Electronics Forum | Mon Nov 13 11:43:04 EST 2006 | fastek
Loco- I was expecting such a response. Look...my point is this....the reflow oven is the most simple piece of equipment on the floor. I can't imagine having to call in BTU repeatedly if it is a fairly recent vintage oven. Plus it sounds like Kris mi
Electronics Forum | Wed Nov 29 10:10:50 EST 2006 | M. Sanders
I'm sorry, Dave - I didn't make myself very clear. Yes, this space (not really a "gap") is filled with solid solder. For instance, if you place a gull-wing component in solder paste, after reflow, there will probably be a thin film of solidied solder
Electronics Forum | Wed Nov 29 16:52:35 EST 2006 | techgonecrazy
OK... My problem with BTUs is that they are getting stopped up because the flux is not going from vapor form to liquid form; instead it is crystalizing (looks like a blizzard took place in the flux box and chiller boxes) and clogging up the flux box,
Electronics Forum | Wed Dec 06 21:28:12 EST 2006 | davef
It's worse than just using the test equipment manufacturer guidelines. Along with that, you have to deal with each of the test fixture fabricators' preferences as well. What this boils down to is a negotiation with the test engineering group as to w
Electronics Forum | Thu Dec 07 11:49:28 EST 2006 | K
We currently have RMA and WS soldering processes here and do batch cleaning for both. We are experiencing some capacity issues and are interested in looking at an IN-LINE aqueous wash. My experience with in-line wash is only with WS. 1. Since RMAs
Electronics Forum | Thu Dec 07 13:51:59 EST 2006 | ganoi
I need advices as to how a gap between the bottom of an LED (1209-package) and the PCB can be controlled on a small rigid-flex PCBA? The problem that we experience is due to tight tolerance in the design of our molded housing in which this PCBA is as
