Electronics Forum | Tue May 26 11:13:49 EDT 2009 | xinxi
Is the components on the top or on the bottom of the pcb? Have you checked whether the temperature on pcb are too high when it pass through SW that it exceeds the limit that the components can take? Do check with the component manufacture for the te
Electronics Forum | Thu Aug 20 15:10:21 EDT 2009 | davef
Responding to your points: * The intermettalic layers [ie, Cu6Sn5, Cu3Sn] between the solder and the copper pad is the same composition with both lead free and leaded solder. The lead in solder has no impact on the intermetallic. * As you say, increa
Electronics Forum | Fri Oct 09 06:53:10 EDT 2009 | taus
Hello, I've recently started to work with MPM AP25, I began doing maintenance to get to know the machine. But now I'm having some problems in the teaching process. You can see the problem in the photo. http://img59.imageshack.us/i/image194p.jpg/
Electronics Forum | Sun Nov 01 23:51:44 EST 2009 | boardhouse
Hi Julie, My opinion is that the top board would not pass IPC, solder mask encroachment on pads. Second board is what we call Orange peel,this can be caused two way's. 1) the solder mask was not tack dried enough prior to imaging which caused artwo
Electronics Forum | Thu Dec 10 05:58:59 EST 2009 | gregoryyork
Best to use Tin treated with TinP Additive. This ensures the Tin is fluid enough to Dissolve any Leaded residues. Run the machine for one hour at 275C then take out wave former and as much of the workings of the pot as possible. Then start bailing ou
Electronics Forum | Wed Jan 27 11:58:35 EST 2010 | randyw
Our products are a mixed technology; with both surface mount components solder side and through-hole top side, in addition to massive heat sink assemblies. We have been using your SN100C solder in our wave solder process with Multicore MFR301 Flux si
Electronics Forum | Wed May 19 17:43:25 EDT 2010 | pforister
Hello, I'm having problems with voiding on an assembly that has a GPS hybrid with balls much like a BGA. This is a RoHS assembly using no-clean solder (Kester EM907). The voids are at or above 25%. I use an 8 zone oven where I peak in zone 7 and
Electronics Forum | Thu Jul 08 09:29:10 EDT 2010 | mb_mfg
There are several things that can be done. Shortening the lead length should eliminate bridging between lead. We had done a project several years ago where the customer had shortened the leads to almost flush to the board, preventing any chance of
Electronics Forum | Wed Sep 29 08:26:03 EDT 2010 | babe7362000
We are Currently running a Board and it seems that the SOT-223's on the bottom side have flux and water trapped under the part. Nothing has changed in our process and this is the only board that it is happening on. We are using Kester R562 water wa
Electronics Forum | Wed Jan 19 12:54:17 EST 2011 | bdamico
Hello Mark, The centroid data you are currently using to program the MV-2HTL may be used with either platform. However, the libraries cannot be shared due differences in camera resolution. The MV-2HTL will have a 1.3 megapixel camera versus the 2 m