Electronics Forum | Fri Oct 08 20:23:23 EDT 1999 | Bix
Can anyone tell me the formula/method to determine the amount of weight that solder's surface tension can support. (ie: Maximum weight of components soldered onto a bottom side of a board during a top side reflow on a Paste/Paste process). Thanks, S
Electronics Forum | Tue Sep 21 08:43:28 EDT 1999 | Christopher Cross
We are finding solder shorts under 1206 Components on the bottom side of our boards.In all cases these shorts are from either side of the component to a feed-thru under the component body. Adhesive is used to glue down the component and then the boar
Electronics Forum | Wed Sep 08 17:28:11 EDT 1999 | Earl Moon
| | Has anybody have any experience with Top placement of BGA's. GLue descretes on bottom and then wavesolder.? | | | | | | | Hi Chris, | Why don't you process a double side reflow and use selective wave fixture for wave process. The process w
Electronics Forum | Thu Sep 09 11:17:59 EDT 1999 | Glenn Robertson
| Has anybody have any experience with Top placement of BGA's. GLue descretes on bottom and then wavesolder.? | | | Chris - This is a common practice. Just remember that BGA solder joints are especially susceptible to secondary reflow damag
Electronics Forum | Wed Jun 09 12:20:26 EDT 1999 | Gang Pan
I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. There is anybody has experience on metal-based PCB reflow process? I guess pre
Electronics Forum | Fri May 21 15:29:26 EDT 1999 | JohnW
Joe.. Sound's pretty neat trick..mind if I ask what type of comp's are on this board and the paste..? This baby (pig I think) has got a 244pin QFP right dam in the middle..!, so if ur flipin it 180 degree's are u using like a piece of Jot in line co
Electronics Forum | Mon May 24 10:33:08 EDT 1999 | Jim Zanolli
Hello John: Teka Interconnection Systems offers an alternative to intrusive reflow for connectors. We can supply the connector with solder and flux pre-applied to each lead. Our system also includes a built in "solder stop" mechanism preventing th
Electronics Forum | Fri Apr 23 14:19:39 EDT 1999 | C.K.
Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free soldering on these guys.
Electronics Forum | Thu Apr 22 09:28:22 EDT 1999 | Michael N.
Well Dave what are pads on the ceramic board is composed of is Paladium Silver but it is on the bottom, then comes the copper, then it is coated with tin, then it is coated again with nickel. What makes it even harder is that are devices are Gold lea
Electronics Forum | Tue Mar 16 15:34:14 EST 1999 | CHUCK B
My engineering Dept. has informed me that they want to start using pins, on an aluminum substrate in the smt process. Pins are interconnect for daughter bds. Dia. of pins 0.020" 0.040" 0.080" flat bottoms 1) Does any one know how to hold pins
.gif)
