Electronics Forum | Thu Jul 31 15:29:25 EDT 2003 | bcceng
A couple of things you can look into 1. The proper bottom pre-heat of board. If you are applying only direct hot air to BGA without preheating can cause BGA's to warp and collapse un-even. 2. Moisture on you BGA's. If BGA's were not properly packa
Electronics Forum | Thu Aug 07 19:48:23 EDT 2003 | Shawn
We do allot of multi layer boards with heavy ground planes or heat sinks attached. We have a Trieber, use RMA flux, solder pot temp at 500F, foam fluxer, spray the top if need be, and would warm up the PWB to around 240F over the preheaters. We have
Electronics Forum | Thu Aug 21 09:01:46 EDT 2003 | caldon
Dan- We here do double sided reflow: we place one side and reflow....place the other side and reflow. On the second flow the underside of the PCB- we will reduce the bottom side preheat. fortunatly for us the largest component we only place a 40pin P
Electronics Forum | Fri Sep 19 15:51:01 EDT 2003 | David Bonilla
Hi I am having solder short defects on the bottom side with SMD devices that run through the Wave solder. May you let me know any IPC guildelines about the spacing, orientation or any other design guidelines for avoid solder defects with SMD device
Electronics Forum | Sun Nov 09 01:58:09 EST 2003 | fastek
Oh Primus I didn't mean it literally! And it doesn't upset me at all. Amazed perhaps but upset....no. The bottom line is either the market is far worse than suspected or Cookson simply had no idea how to run and manage perhaps the best collection o
Electronics Forum | Thu Dec 11 23:38:44 EST 2003 | liang
Thank you Stefan for your help! our machine is hs50.you are right we means components are not placed on board.we can found the part around the loctation.i found bearing is dirty.i clean it with threebond.it can work well. but i want to know the rootc
Electronics Forum | Tue Jan 27 04:27:59 EST 2004 | loz
Thanks Dave, sounds totally plausible. In answer to Pete B's questions 1. Spot mask IS only being applied to earthing points, top and bottom side. 2. Unsure. Speaking to manufacturer they are telling me it is compatable. However data sheet is vague.
Electronics Forum | Thu Feb 05 19:19:51 EST 2004 | alwil
Thanks for the feedback guys. We have Fuji IP3's, so we can save all the reels and bottom tape too. Stick feeders are a nightmare. Lost production due to the long set up times of vibratory feeders is ridiculous. Also, pick up rate is inconsistant fro
Electronics Forum | Wed Feb 18 12:32:59 EST 2004 | babe
A hot plate should do it. Since your throwing the board away a good hot plate could get you to just above reflow topside and you could remove them all at one time. To do this however the bottom side of the board would probably be damaged, but you don
Electronics Forum | Thu Apr 22 12:27:47 EDT 2004 | barry
I placed thermo's at 2 of the problem devices. Soak (time 150 to 180) 100 sec. Time above 180 =80 secs with 208 deg. peak. The solder appeared to flow at these pads, but little to no adhesion to the joint.Total time in oven was 5 min. All other joint
