Electronics Forum | Tue Feb 28 13:28:29 EST 2023 | markhoch
If you decide on an epoxy floor, make sure you use a contractor that is experienced with installing ESD epoxy floors. The epoxy needs to be continuously mixed to keep the media consistent throughout. We had a contractor who failed to do that, and wh
Electronics Forum | Wed Jul 19 12:54:04 EDT 2023 | calebcsmt
Since side fillets are not a requirement for QFNs/BTCs due to some packages not having wettable side terminations, how does one determine if the side terminations are actually solderable/designed for wetting? Is it simply if the side terminations
Electronics Forum | Mon Oct 02 13:46:53 EDT 2023 | SMTA-72837649
If it's the same as the 32D, 2 things need to happen. Air pressure at the nozzle for atomization, and the solenoid at the bottom of the flux tank needs to open to provide a gravity stream of flux. You should be able to take both hoses off and check f
Electronics Forum | Fri Jan 12 06:45:52 EST 2024 | calebcsmt
When conformal coating a PCB, when it comes to components such as alum caps, if no keep-out specified for SMT, would you recommend coating the entire component, or would you only coat the bottom portion (where conductors/leads are present) Moreover,
Electronics Forum | Thu Apr 13 11:38:53 EDT 2000 | Kevin Facinelli
Couple more questions: The problem we have is that on the bottom side we are using a bunch of resistor networks. These have been very difficult to solder through the wave. The products: Top Side: 4-6 BGA 2/3 QFP 500 component
Electronics Forum | Thu Jul 20 16:10:34 EDT 2000 | armintan
Hi Bob, From my memory about almost 4 yrs. ago, I remember we did something similar to this in Apple Computer Singapore. Process sequence are: Bottom Side Process: Print Solder Paste(Dek 265GS) Dispence Adhesive (Cam/Alot 3800) Place Components (
Electronics Forum | Thu Sep 09 10:34:02 EDT 1999 | John Thorup
| I am wave soldering a single sided through hole PCB array with (6) .040" round diameter pins that sit .5" off the PCB, and .080" apart. The problem being experienced is that solderballs are appearing on the end of the pins. I have tried decreasin
Electronics Forum | Fri Aug 13 07:26:06 EDT 1999 | Brian Conner
| | We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave
Electronics Forum | Thu Jun 17 09:50:27 EDT 1999 | Brian Wycoff
| | WOULD LIKE TO DO RELOW OF 2 SIDED SMT BOARDS. USUALLY THE BOTTOM SIDE HAS RESISTORS AND CAPS ONLY. WHEN THE BOTTOM OF THE BOARD HEATS UP, THE PARTS ARE FREE TO MOVE AND ONLY SURFACE TENSION WILL KEEP THE COMPONENT FROM FALLING OFF. | | CAN BOARDS
Electronics Forum | Thu Jun 10 11:23:10 EDT 1999 | Gang Pan
| | I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | | There is anybody has experience on metal-based PCB reflow process? I g