Electronics Forum | Thu Jul 06 07:40:51 EDT 2000 | Christopher Lampron
SAL, How large is the pad in relation to the solderable area on the component. I have seen similar instances where the heat sink of the component covered almost the entire bottom of the part. If your pad is the same size and the aperture is 1:1, ther
Electronics Forum | Fri Jun 23 09:01:01 EDT 2000 | Dave F
Gary: According to what I was try to say, you have read me correctly. NOW ... I would not pay much attention to my 100�C delta T babbling. It is in our work instruction for setting-up the wave, but no one pays attention to it. And I, nor anyone e
Electronics Forum | Tue Jun 20 20:22:15 EDT 2000 | Dave F
Hi Jack: Welcome!!!! Yours sounds like an interesting project. In response to your questions: A1. Each traditional L8 run requires 8 runs. So, how did you select a L8? A2. In addition solder height and volume as characteristics, consider deposit
Electronics Forum | Fri May 05 11:58:25 EDT 2000 | John Sims
We are using NR300F from Alpha. Topside board temp is 220 deg. F. We have 3 bottom side convection preheaters, and we use a foaming fluxer. The machine (except for the rotary chip wave) is almost identical to the old econopak. An electrovert appl
Electronics Forum | Thu Apr 27 15:26:02 EDT 2000 | D Scott
Ron, I too use a Nicolet NXR 1400i. By using the rotation fixture and offsetting the board, a good BGA solder joint will appear elongated. If you rotate the board away from you the wetted joint will appear to lighten and become flat (looking at the
Electronics Forum | Sun Apr 16 14:37:25 EDT 2000 | Roberto Navarro
Hi, I work for Nortel and here rework BGA'S we use DRS22 rework station and CRT 2000 X-ray inspection. The main problem is put again the BGA on the PCB because you need reboling the PCB and you could damage the soldermask. Talking about Air-vac is ve
Electronics Forum | Fri Mar 31 14:23:13 EST 2000 | JAX
Hey Dave, thanks for the sparkling endorsement! No really, You have to be realistic when presenting your case. Once you understand that company decisions, like it or not, are based on the bottom line, the way you present your case will be clearer. I
Electronics Forum | Fri Mar 31 14:24:10 EST 2000 | JAX
Hey Dave, thanks for the sparkling endorsement! No really, You have to be realistic when presenting your case. Once you understand that company decisions, like it or not, are based on the bottom line, the way you present your case will be clearer. I
Electronics Forum | Thu Feb 24 00:06:00 EST 2000 | Ver Viray
Hi, Can anyone help me on how to choose profile points in wave soldering...e.g. smallest like R, C, to biggest like transformer heatsink etc.... Are the thermo-couples supposed to be on top of the pcb or at the bottom touching the solder bath when fl
Electronics Forum | Tue Feb 22 05:50:40 EST 2000 | Arulvanan P
Hi, I am in the process of implemeting Through Hole Reflow. 1.I would to know which are the products/Companies that use that use this process. 2. Is there any reference / standard to convince my QA dept. to accept the boards even though there is no
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