Electronics Forum: bottom and side (Page 1 of 144)

Process ideas for adhesive on bottom side SMD's and wave solder

Electronics Forum | Tue Nov 22 17:08:03 EST 2011 | mikenagle

I am looking for process suggestions. We want to use a pin transfer system to deposit adhesive to hold bottom side SMD's in place. We will place SMD's and through hole power parts on the top side and then run through a wave solder machine. Are ther

Process ideas for adhesive on bottom side SMD's and wave solder

Electronics Forum | Wed Nov 23 07:30:44 EST 2011 | scottp

Are you stuck with pin transfer for some reason? Screen printing is more repeatable and easier to maintain.

Process ideas for adhesive on bottom side SMD's and wave solder

Electronics Forum | Wed Nov 23 07:38:49 EST 2011 | davef

We agree with the points made by ScottE above. Additionally, most printers are not heavily loaded. So, you wouldn't have to buy another machine, give-up floor space, purchase and store peculiar tooling, etc. We think Darby does pin transfer. Maybe h

Process ideas for adhesive on bottom side SMD's and wave solder

Electronics Forum | Wed Nov 23 09:38:52 EST 2011 | blnorman

More agreement with screen print adhesives. Back in a former life time we did do pin transfer on one of our product lines. If you had to go with pins, make sure your adhesive rheology is suited for it. Different adhesives are designed for specific

bottom side epoxy

Electronics Forum | Wed Oct 06 21:45:20 EDT 1999 | John

I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement b

Re: bottom side epoxy

Electronics Forum | Thu Oct 07 03:08:57 EDT 1999 | Chris May

I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement

Re: bottom side epoxy

Electronics Forum | Thu Oct 07 05:53:54 EDT 1999 | Wolfgang Busko

I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placeme

Re: bottom side epoxy

Electronics Forum | Fri Oct 08 16:48:24 EDT 1999 | Charles Morris

I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement

Re: bottom side epoxy

Electronics Forum | Thu Oct 07 09:59:01 EDT 1999 | Dave F

I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement

Bottom side smt and thru hole

Electronics Forum | Tue May 26 22:13:15 EDT 1998 | Pat Copeland

R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recommende

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