Electronics Forum | Thu Dec 29 22:19:36 EST 2005 | Joseph
We have tested SN100C for LF wave soldering process since August'05 and currently start production for a month ago. Initially we use SAC305, but due to the shrinkage cavities (micro-crack) we changeover to SN100C. In summary, SN100C did perform well
Electronics Forum | Tue Mar 07 21:35:16 EST 2006 | Cal Kolokoy
Samir, From experience, the only board test situation where tented via's have difficulty with contact is with a Flying Probe type tester. Otherwise, for traditional ICT, the force of the pogo pins, correct probe type, and fixture design should do th
Electronics Forum | Wed Apr 19 04:41:42 EDT 2006 | ge_lim
Hi I am using selective soldering to dip soldering the connector pins to the PCB and would like to know your experience: a) Is there a recommended dip or dwell time for the dip soldering? b) How do we improve the solder coverage in the TH? c) How t
Electronics Forum | Thu Apr 20 08:49:08 EDT 2006 | Chunks
a) Is there a recommended dip or dwell time for the dip soldering? Check your data sheet for the part. Dwell time is everything in selective soldering. Top side wetting is a good process indicator. b) How do we improve the solder coverage in the
Electronics Forum | Fri Aug 25 14:39:24 EDT 2006 | davef
1 When you peel the solder connection of a BGA, * If solder remains on the soldered surface [eg, component, substrate, etc], it's good. * If some solder remains and some base metal is present, it's marginal. * If no solder remains, it's NG. 2 Try I
Electronics Forum | Tue Oct 03 14:14:06 EDT 2006 | slthomas
What is the likelihood that we'll be able to manually dispense paste on 25 mil pitch, 20 mil pads and get away without bridges? We have a CTS Series 753 resnet we need to place and the build qty (30) and board layout (.5" x 1.2" unpanelized, 2-sided)
Electronics Forum | Tue Oct 17 20:15:12 EDT 2006 | davef
In the past, black poly was used as a bridge between pink poly and shield bags because of slightly lower cost and offering some shielding as opposed to none with pink poly. However, as the price of shield bags continue to drop the usage of black poly
Electronics Forum | Mon Nov 27 16:19:14 EST 2006 | greg york
Sorry Bill We have filled and supported over 250 Lead free machines now and have actually moved the angle back to 7 degrees the same as Leaded and the bridging problems have gone away.Dwell times are only fractionally longer and results are very goo
Electronics Forum | Thu Nov 30 19:55:30 EST 2006 | greg york
This may be worth checking out are you sure it is flux residue and not undercured plasicizers coming from solder resists due to the higher Lead Free temperatures killing the undercured resist, this causes many no faults found and bridging, solderball
Electronics Forum | Fri Dec 01 08:09:08 EST 2006 | CK the Flip
Square-leaded pin headers will typically bridge at the trailing edge (last couple of leads), since during peel-back, the solder at the trailing edge has "nowhere to go". If you have control over designs, ask your designers if they can put solder thi
