Electronics Forum | Tue Jun 11 22:06:06 EDT 2002 | scottxiao
I encounter the problem, it is easy for pad(copper) to drop off from the PCB, which is Ni/Au finish. so my question is whether there is any specification about the force between pad and laminate material, and does the PCB corpoartion test this parame
Electronics Forum | Wed Jun 12 20:04:03 EDT 2002 | scottxiao
Thank you very much!
Electronics Forum | Mon Jun 17 13:45:29 EDT 2002 | genny
When the pad comes off, is it leaving behind a "black" area? Your board may be suffering from black pad - a condition that occasionally affects ENIG finish boards. It is a process control issue with your board fabricator. The nickel is oxidising b
Electronics Forum | Thu Jun 20 03:15:22 EDT 2002 | Paul
I've seen a problem recently where there was 2 deposits of Nickle then Gold, The problem is the Nickle will not adhere to Nickle, see if you can scrape the pad away with a scalpel.
Electronics Forum | Thu Jun 20 04:49:34 EDT 2002 | scottxiao
according to the ressult of cross-section and removing the component, I find there is no black area in the left pad, and the IMC is also normal, so the black nickle is less impossible. the PCB material is not common FR4, just some thing like ceramic,
Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef
Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1
Electronics Forum | Thu Aug 17 23:44:26 EDT 2006 | guest
CBGA stands for Ceramic Ball grid array while PBGA stands for Ceramic Ball grid array. Noticable difference is the substrate used , one is using ceramic and one is using BT laminate. Regards
Electronics Forum | Sun Feb 02 10:00:55 EST 2003 | davef
Mitsubishi Gas & Chemical's Bismaleimide-Triazine (BT) resin laminates are the defacto standard material for BGA. Have you checked with them?
Electronics Forum | Wed Aug 27 13:08:30 EDT 2008 | vladig
Td - is the degradation temperature for a laminate (board), while Tg - is glass transition one. There is one more (even more important) - delta Tg. They characterize the quality of the laminate material. Regards, Vlad www.sentec.ca
Electronics Forum | Mon Apr 25 22:56:44 EDT 2005 | davef
rush316 First, no one stated that PBB and/or PCBE are in FR4. FR4 contain tetra-bromo-bisphenol A [TBBA]. Second, there are classes [and grades] of dielectric materials used in fabricating printed circuit boards. Grades, NEMA LI-1. From these gr
