Electronics Forum: btc (Page 1 of 3)

QFN standoff, industry standard

Electronics Forum | Thu Mar 28 13:19:14 EDT 2019 | davef

There is no industry standard for BTC stand-off height. "IPC-7093A Design and Assembly Process Implementation for Bottom Termination SMT (BTC) Components" just finished "Final Draft for Industry Review" in December 2018. It mentions stand-off height

QFN standoff, industry standard

Electronics Forum | Wed Mar 27 04:32:49 EDT 2019 | pavel_murtishev

Charliem, Thank you for the input. Following this logic, in case if there are no soldering issues, pad coverage and voiding levels are within acceptable limits and a gap between BTC and pad let us say 200um, this could be accepted, right? IPC-A-61

Void under QFN TI LMZ20502SILT

Electronics Forum | Fri Jul 27 09:47:20 EDT 2018 | davef

Adding to Rob's suggestions ... One of the theories about voiding in thermal / ground pads of BTC is: Solder starts melting at the edge of the pad and moves inward towards the center of the solder mass. This traps flux volatilizes. So, there needs t

Best Lead Free Solder to use

Electronics Forum | Tue Mar 01 15:13:22 EST 2011 | felixgutierrez

Hi Everyone. I would like your input in regards to lead free solder paste lead free. Which one is the most reliable solder for BGA's and BTC's (QFN). I have used different type of solder and on some of them i get big voids on BTC's and other one i g

Voids with LGAs

Electronics Forum | Fri Jan 18 14:39:07 EST 2013 | davef

Main issues with LGA voiding are: * Design * Material selection * Thermal recipe For design, loo here http://blogs.smtnet.com/smt/other/qfn-btc-design-guidelines-thermal-pads-etc/ BR, davef

QFN PCB Pad no Drain Hole

Electronics Forum | Fri May 17 14:56:21 EDT 2013 | davef

There's not supposed to be any effin 'drain hole.' Where's you get that from? Read this: http://blogs.smtnet.com/smt/other/qfn-btc-design-guidelines-thermal-pads-etc/ BR davef

IPC A-610 Moving from Rev E to Rev F

Electronics Forum | Tue Jul 04 20:31:21 EDT 2017 | davef

If you want in, 5-21h Bottom Termination Components (BTC) Task Group is in "Working Draft" revision from "A" to "B" of IPC-7093 - Design and Assembly Process Implementation for Bottom Termination SMT Components

QFN/BTC Pad Configuration Commonality for Solder Stencils

Electronics Forum | Tue Apr 30 12:11:05 EDT 2019 | slthomas

That's a good summary and the only thing I would add to that is maybe to include an image of the land pattern in your collection. Some of these asymmetrical parts are just about impossible to provide all of the dimensions for. For instance, who want

QFN/BTC Pad Configuration Commonality for Solder Stencils

Electronics Forum | Tue Apr 30 14:56:43 EDT 2019 | SMTA-Joe

Thanks for the suggestions. This seems like the way I'll have to go; create my own database and hope something--one day--comes up the same specs!

QFN Side fillet

Electronics Forum | Mon Jul 22 13:19:31 EDT 2019 | davef

While we're are it, here's a link to a recent FORUM thread that talk's about BTC standoff height: https://smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=21852&mc=9

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