Electronics Forum: btc and voids (Page 1 of 6)

Altitude and solder voids

Electronics Forum | Thu Nov 01 10:57:34 EDT 2012 | kris1128

Has anyone heard whether the elevation of a plant can effect solder joint formation? One plant at sea level, one at 7,000 feet elevation... same equipment and profiles, big voiding defects at higher elevation. I did a search and found no similar post

Imm Silver and Voiding

Electronics Forum | Thu Jun 22 17:47:05 EDT 2006 | davef

First, we expect voiding in imm silver to be similar to ENIG. We expect more voiding in OSP than other common solderability protection. Second, choosing a solder paste, which does not contain resins and activators that decompose at higher temperatu

N2 and Voiding??

Electronics Forum | Wed Oct 17 09:55:48 EDT 2012 | anvil1021

Has anyone ever experienced void increase while using N2? Thanks for the Help!! anvil

Voids and BGA

Electronics Forum | Sun Mar 01 14:51:55 EST 1998 | Vincenzo Longobardo

From several months I am investigation about the VOIDS PERSENCE and his important as reliability. One question now is : It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? If you ha

Imm Silver and Voiding

Electronics Forum | Thu Jun 22 00:16:24 EDT 2006 | Gman

Hello, Has anyone had issues with voiding while using Imm Silver PCB finish. Does thickness of silver, contamination of the plating bath or other factors if you come point out cause voids due to the plating.

Imm Silver and Voiding

Electronics Forum | Fri Jun 23 10:10:15 EDT 2006 | Gman

Some amount of voiding was always seen on sites where solder paste is printed. These voids are much smaller. However the site where a flip chip is flux dipped has never had problems with voiding. Macro voids (and huge ones at that)across the board s

N2 and Voiding??

Electronics Forum | Thu Oct 18 11:08:22 EDT 2012 | scottp

Since we follow IPC Class III, I've done experiments turning N2 on and off and measuring void level with both SnPb and SAC305 solder. In both cases there was a statistically significant, measurable increase in voids with N2, but it wasn't significan

Imm Silver and Voiding

Electronics Forum | Mon Jun 26 08:08:32 EDT 2006 | davef

It does make you think the immersion coating is causing the voiding, doesn't it? We never have seen that.

Imm Silver and Voiding

Electronics Forum | Wed Jun 28 16:16:09 EDT 2006 | Gman

Good article. Would EDX analysis of the cross-section at the void joints be a good method to determine any plating contamination or solder mask issues?

Re: Voids and BGA

Electronics Forum | Sun Mar 01 15:52:13 EST 1998 | Earl Moon

From several months I am investigation about the VOIDS PERSENCE and his important as reliability. One question now is : It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? I

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