Electronics Forum | Wed Mar 25 16:36:10 EST 1998 | Steve Joy
We have successfully put .016" vias in .030" pads. There is no drain off with .030" solder balls, since the actual volume in the .002" depression is low. We did notice random bubbles where, apparently, the solder reflowed and trapped the air in the
Electronics Forum | Wed Mar 25 19:41:01 EST 1998 | Earl Moon
| We have successfully put .016" vias in .030" pads. | There is no drain off with .030" solder balls, since | the actual volume in the .002" depression is low. | We did notice random bubbles where, apparently, the | solder reflowed and trapped the a
Electronics Forum | Fri Mar 20 10:31:19 EST 1998 | Mick Jones
| I will be starting a conformal coating process soon, I am looking for any pointers on | 1) Best method for masking components, tape mask, liqued mask | 2) Which is best Spray or Dip? | 3) Compatiblity with no clean solder paste (flux residue) | I h
Electronics Forum | Tue Oct 16 07:00:06 EDT 2001 | genglish
Hi all, I have a problem and would gratefully take on suggestions, firstly let me explain the situation: We are currently screen printing adhesive, using a method similar to DEKs 'Pump Print', The adhesive we are currently using is supplied from Alp
Electronics Forum | Wed Oct 24 14:06:37 EDT 2001 | mparker
If you let your design team leave things up to chance, chances are something will go wrong. You are right to want to take control rather than be lead down an undesirable path by the fab house. Various masks serve certain desirable purposes. You need
Electronics Forum | Sat Jan 19 02:25:37 EST 2002 | ianchan
Hi, Have a board run, using 63/37 Water Souble (WS) process. during the reflow setup time, we had unsolder issues on a leadless bump chip carrier (BCC) IC level package. To rectify the unsolder rejects, we adjusted the reflow time from 25-55sec into
Electronics Forum | Wed Jan 30 17:48:31 EST 2002 | davef
Expanding on a previous poster's comments ... Vapor Phase Soldering. A solder reflow technology that uses a heated solvent to melt the solder. Buried deep in the recesses of the SMTnet Library is �Terms & Definitions�. We started using vapor phas
Electronics Forum | Fri Apr 26 10:42:28 EDT 2002 | Jim M.
I worked for a telecom company that had sites in the deserts, jungles, mountains and regular built up area's. All boards were built using Aim 291/293 No clean solder paste. (all boards built to Bellcore standard) The boards were coated with Dymax ur
Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis
Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in
Electronics Forum | Wed Jul 21 13:18:19 EDT 2004 | patrickbruneel
Thomas, The first thing I would suggest you to do is identify the type of problem your dealing with �pinhole� or �blowhole� before you can take the appropriate action to correct the problem. A pinhole is a void or cavity caused by non-wettable part