Electronics Forum: burn (Page 31 of 53)

Soldering Test Interview

Electronics Forum | Wed May 04 10:27:33 EDT 2005 | nice90

Or you can use the Hot Air (Hakko) to remove that component and a tweezer to pull it. dont pull it just yet. If you see the solder melting then feel the component using the tweezer by wiggling it a bit and if you can wiggle it only then you can pull

mechanical pelletizer

Electronics Forum | Tue May 24 18:00:42 EDT 2005 | davef

Pellet Fuels Institute; 1601 N. Kent Street, Suite 1001, Arlington, VA 22209; 703-522-6778 Fax 703-522-0548 pfimail@pelletheat.org http://www.pelletheat.org Pellet Fuels Institute represents the fuel preparation and clean burning technology of

PCB SolderPad Yellowish

Electronics Forum | Mon Sep 05 01:38:12 EDT 2005 | plcc

I hv a PCB (mtrl is RF35). After going thru' reflow, we found yellowish stain on the solder pad (solder mask). It looks like burn-marks. The reflow temp use is 245oC. We tried running bare pcb under 220oC, there's minimum stain found (acceptable),how

Urgent!! ... AI process after SMD Reflow Soldering

Electronics Forum | Thu Sep 15 22:36:24 EDT 2005 | Ken

1. How did your customers preious supplier deal with this problem? 2. Why did they not alert you these sepcial needs during the quoting process? If they have special needs then relegate the parts to hand-stuff. Don't forget to adjust your price

Full IR Reflow versus conventional convection ?

Electronics Forum | Thu Mar 23 18:31:31 EST 2006 | Chris

Mike, Have you contacted Universal Instruments yet? If not you should call them. If I am thinking of the same oven, this oven was manufactured by ETS (Energy Technology Systems) or http://www.energytechnologysystems.com. I take it you bought this

Internal Oven Calibration

Electronics Forum | Fri Feb 10 11:33:32 EST 2006 | fredericksr

I am putting together an internal oven calibration procedure. I am interested in how stringent your oven calibration process is. Really what I am putting out is a verification process and a calibration process for the event that verification should

leadfree solder content to avoid wire being thin

Electronics Forum | Tue Feb 28 10:18:35 EST 2006 | Steve Gregory

I just went through the same problem. We have an inductor that is made with a bundle of 30-strands of Litz wire that is vaccuum coated with varnish, and have the ends of the wire bundles tinned that we have to solder to SMT pads on the board. The ind

Necessity of ROSE in commercial quality processes

Electronics Forum | Tue Feb 28 14:32:26 EST 2006 | masrimhd

As I know, the encapsulation effect occurs only with rosin based fluxes. So if you have a PBA soldered using RA Flux, you should either wash it well, or leave it alone and it will be safe. For NC process the story is different because there�s no re

Hybrid Profile

Electronics Forum | Sat Apr 15 09:07:22 EDT 2006 | samir

Amol, We pulled off this "hybrid profile" with a leaded solder paste. We recently got our tensile test report results, and our Pb-Free BGA / Pb Paste sample broke off during tensile tests at the pad/substrate interface, and not the joint. This ind

Flux Compatibility Issues....

Electronics Forum | Tue Jun 06 12:42:24 EDT 2006 | samir

Wave flux, although I've seen it used successfully in my past life, is not such a good idea to use as a rework/touchup flux. Wave flux needs to be heated to certain activation temps which won't be repeatedly achieved with a manual soldering process.


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